Probe Card Inspection Circuit for Semiconductor Contact Verification

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing substrate inspection apparatuses for semiconductor devices cannot accurately check contact between probes and electrode pads without an IC tester, making it difficult to determine the cause of abnormal states during inspection.

Innovation Solution

A substrate inspection apparatus with a probe card equipped with an inspection circuit that replicates the circuit configuration of a mounted semiconductor device and a potential measuring unit, using a comparator to determine contact states by measuring the potential of the line between the probe and the inspection circuit, allowing for contact checks without an IC tester and identifying abnormal states.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a prober is connected to an IC tester to perform contact check, then the contact between probe and electrode pad can be checked, but the cost increases and the system becomes complex

Engineering Contradiction:
Improvecontact check accuracyVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the contact check function from the IC tester and implements it independently within the prober system. The potential measuring unit is built into the prober, allowing contact checks to be performed without relying on external IC tester equipment, thus reducing system complexity while maintaining measurement accuracy

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a potential measuring unit as an intermediary component between the probe and the inspection circuit. This unit specifically measures the potential of the line between the probe and inspection circuit, enabling contact verification without requiring the complex DC module and IFVM function of an IC tester

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of information

If an IC tester is used to determine the cause of abnormal state, then the cause can be identified, but the equipment cost increases

Engineering Contradiction:
Improveabnormal state diagnosisVSAvoidequipment cost
Core Design Contradiction:
Loss of informationVSQuantity of substance

Solution Approach 1:

The patent creates a simplified copying version of the IC tester's measurement capability by implementing a potential measuring unit within the prober. This unit replicates the essential function of measuring line potential to diagnose contact abnormalities, providing the same diagnostic information without requiring expensive IC tester equipment

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent replaces the expensive, complex IC tester with a simpler, more cost-effective potential measuring unit integrated into the prober. This cheaper measurement system performs the essential contact check function without needing the full capabilities of a high-priced IC tester

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate contact checks between probes and semiconductor devices without an IC tester, stabilizing current flow for reliable electrical property measurements and determining the cause of abnormal states.

Implementation Method 1

a potential measuring unit configured to measure a potential of a line between the probe and the inspection circuit

Methodology Applied
Scientific EffectPotential measurement: Electric Field

Data Source

PatentUS9678107B2Substrate inspection apparatus
Publication Date: 2017.06.13 TOKYO ELECTRON LTD
  • US9678107B2 patent drawing
  • US9678107B2 patent drawing
  • US9678107B2 patent drawing

AI summary

There is provided a substrate inspection apparatus in which a contact between a probe and a semiconductor device is checked without using an IC tester. Further, when an abnormal state is detected in the contact check, a cause of the abnormal state can be determined. A prober includes a probe card having a plurality of probes to be contacted with respective electrode pads of the semiconductor device formed on a wafer W. The probe card includes a card-side inspection circuit configured to reproduce a circuit configuration of DRAM in which the semiconductor device cut from the wafer W is to be mounted, and a comparator configured to measure a potential of a line between the probe and the card-side inspection circuit.