Probe Card Level Controller for Semiconductor Testing
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Solution Overview
Problem
Existing semiconductor device testers face challenges in accurately controlling probe card deformations during electrical characteristic testing, leading to inconsistent contact with test pads and reduced reliability in the electrical die sorting process.
Innovation Solution
A tester and test apparatus with a level controller that independently restricts peripheral and central deformations of the probe card using a combination of elastic members and split plates, ensuring accurate control of the probe card's level and maintaining consistent contact with semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a probe card is used for testing semiconductor devices, then electrical characteristics can be measured, but the probe card deforms under thermal and mechanical stresses leading to inconsistent contact
Solution Approach 1:
The level controller is divided into multiple independent lower plates (first lower plate for central portion, second lower plates for peripheral portions) that can move independently. This segmentation allows different regions of the probe card to be controlled separately, compensating for localized deformations under thermal and mechanical stresses.
Solution Approach 2:
Different regions of the probe card are subjected to different restrictive forces through the elastic members connected to respective lower plates. The central portion and peripheral portions can be independently adjusted to maintain proper contact levels despite non-uniform thermal expansion or mechanical deformation.
2Manufacturing precision
If the probe card is restricted from deforming, then contact consistency improves, but the complexity of the control mechanism increases
Solution Approach 1:
The elastic members automatically adjust the position of the lower plates in response to probe card deformation. When the probe card deforms, the elastic members exert restrictive forces that push the lower plates to compensate for the deformation, providing self-correcting level control without complex external actuation systems.
Solution Approach 2:
The lower plates act as intermediary elements between the probe card and the base structure. These plates can move independently to absorb and compensate for deformations, serving as a mechanical buffer that maintains contact consistency without requiring direct complex control of the probe card itself.
3Device complexity
If the probe card is allowed to deform freely, then the structure remains simple, but contact accuracy deteriorates leading to reduced testing reliability
Solution Approach 1:
The system changes the physical state of the lower plates from fixed to movable, allowing them to dynamically adjust their positions in response to probe card deformation. This parameter change enables the structure to maintain simplicity while achieving contact accuracy through the movement capability of the lower plates rather than complex rigid constraints.
4Reliability
If multiple lower plates are used to control different portions of the probe card, then deformation control improves, but the number of components increases
Solution Approach 1:
The level controller is divided into multiple independent lower plates (first lower plate for central portion, second lower plates for peripheral portions) that can move independently. This segmentation allows different regions of the probe card to be controlled separately, compensating for localized deformations under thermal and mechanical stresses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively restricts deformations, improving the reliability of electrical tests by ensuring accurate contact between probe tips and test pads, reducing maintenance costs, and maintaining the probe card's level despite thermal and mechanical stresses.
Implementation Method 1
a first elastic member interposed between the upper plate and the first lower plate to apply a first restrictive force to the central portion of the probe card in proportion to a central deformation, to restrict the central deformation of the probe card
Implementation Method 2
a second elastic member interposed between the upper plate and the second lower plate to apply a second restrictive force to the peripheral portion of the probe card in proportion to a peripheral deformation, to restrict the peripheral deformation of the probe card
Data Source
AI summary
A tester includes a level controller for independently restricting the central deformation and the peripheral deformation of a probe card. The level controller includes a single upper plate, a single first lower plate and a plurality of second lower plates. A first elastic force is applied to a central portion of the probe card by the first lower plate to restrict the central deformation. Second elastic forces are independently applied to peripheral portions of the probe card by the individual second lower plates to locally restrict the peripheral deformations.