Opto-Electrical Probe Card Alignment for Wafer-Level Optical MEMS Testing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing probe card technologies for optical MEMS wafers require separate testing of dies, which is costly and time-consuming, and lack efficient methods for simultaneous electrical and optical signal testing at the wafer level.
Innovation Solution
An apparatus comprising an electrical probe card with alignment needles, an optical head, an optical positioner, a camera, and a processor for aligning and testing optical MEMS structures on a wafer, enabling simultaneous electrical and optical signal testing through optical fibers or free-space optics, with AI-based alignment and calibration for efficient wafer-level testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate die-level testing is performed after wafer dicing, then individual die functionality can be verified, but production time and assembly cost increase significantly
Solution Approach 1:
The patent combines electrical probing and optical testing into a single integrated probe card system that operates at the wafer level. The probe card simultaneously makes electrical contact with pad structures and directs optical signals through waveguide structures, allowing both electrical and optical functionality to be tested together on the wafer before dicing, thereby eliminating the need for separate die-level testing steps
Solution Approach 2:
The patent performs both electrical and optical testing before the wafer is diced into individual dies. By conducting wafer-level testing that includes electrical pad probing and optical waveguide characterization in advance, the system identifies functional defects early in the manufacturing process, avoiding the need for subsequent die-level testing and rework after dicing
2Ease of manufacture
If traditional electrical probe cards are used for optical MEMS testing, then electrical signals can be probed, but optical signal testing requires separate complex optical alignment systems
Solution Approach 1:
The patent integrates optical testing components directly into the electrical probe card structure. Optical fibers are embedded within the probe card body, and optical waveguides are incorporated into the probe tip, allowing optical signals to be delivered and collected at the same location where electrical probing occurs. This integration eliminates the need for separate optical alignment systems and simplifies the overall testing apparatus
Solution Approach 2:
The probe card is designed to perform multiple functions simultaneously: it provides electrical contact through metal needles for electrical signaling, incorporates optical fibers for light delivery and collection, and includes waveguide structures for optical signal transmission. This multi-functional design allows a single device to handle both electrical and optical testing without requiring separate specialized systems
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Aspects of the disclosure relate to an apparatus including an opto-electrical probe card platform for wafer-level testing of optical micro-electro-mechanical-systems (MEMS) structures. The probe card platform includes an electrical probe card including alignment needles for aligning with an optical MEMS structure during testing thereof. The probe card platform further includes an optical head configured to direct input light to towards the optical MEMS structure through the electrical probe card and an optical positioner attached to the electrical probe card and configured to align the optical head. The apparatus may further include a camera and a processor configured to process at least one image obtained by the camera and to generate alignment assistance data to assist the optical positioner in aligning the optical head.