Probe Card Frame With Independent Movable Pressure Members

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Solution Overview

Problem

Conventional testing methods for stack packages with through-substrate vias (TSVs) are limited, as they typically require probing on a single wafer containing multiple semiconductor chips, making it difficult to efficiently test and differentiate between unpackaged sets of chips with varying heights and types.

Innovation Solution

A probe card with a main circuit board, frame, and cover plate is used to test multiple unpackaged sets of chips, featuring independent movable members for each socket to ensure proper contact and pressure, allowing for simultaneous testing of chips with different heights and types by adjusting the pressure and height of pressure members.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a single wafer probing method is used to test stack packages, then the testing process is simplified, but it becomes difficult to efficiently test and differentiate between unpackaged sets of chips with varying heights and types

Engineering Contradiction:

Improvetesting process simplicityVSAvoidcapability to test chips with varying heights and types

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The probe card is divided into multiple independent sockets, each capable of receiving and testing individual unpackaged sets of chips. Each socket is equipped with independent movable members that can be adjusted separately, allowing the system to accommodate chips of different heights and types simultaneously while maintaining individualized testing capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The movable members in each socket are designed to be independently adjustable, enabling dynamic adaptation to different chip configurations. This allows the testing system to flexibly accommodate varying chip heights and types by adjusting the position and pressure of each movable member individually, transforming a static single-wafer probing approach into a dynamic multi-socket system.

Inventive Principle:

Principle #15Dynamics

2Productivity

If multiple unpackaged sets of chips are tested simultaneously on a single wafer, then testing efficiency is improved, but it becomes difficult to apply different pressure and height adjustments for each socket

Engineering Contradiction:

Improvetesting efficiencyVSAvoidability to adjust pressure and height per socket

Core Design Contradiction:

ProductivityVSEase of operation

Solution Approach 1:

The probe card features multiple independent sockets with separately controllable movable members. Each socket can be adjusted independently in terms of pressure and height, allowing simultaneous testing of multiple unpackaged sets of chips while maintaining individualized control over each testing position.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each socket is equipped with its own movable member that can be independently adjusted to provide localized pressure and height control. This ensures that each unpackaged set of chips receives the appropriate testing conditions specific to its configuration, even while multiple chips are being tested simultaneously across different sockets.

Inventive Principle:

Principle #3Local quality

3Device complexity

If chips with different heights are tested using a fixed probing system, then the system structure is simplified, but proper contact with probes cannot be ensured for all chips

Engineering Contradiction:

Improvesystem structureVSAvoidprobe contact consistency

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The system incorporates movable members in each socket that can be independently adjusted to accommodate different chip heights. These movable members dynamically adapt their position and pressure application point to ensure reliable probe contact with chips of varying heights, transforming a fixed structure into a flexible, adaptive system.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The design combines a relatively simple fixed socket structure with independently adjustable movable members. This merging of fixed and movable elements maintains overall system simplicity while ensuring reliable probe contact across chips of different heights through the added flexibility of the movable components.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS8541889B2Probe card including frame and cover plate for testing a semiconductor device

Publication Date: 2013.09.24 SAMSUNG ELECTRONICS CO LTD

AI summary

A probe card includes a main circuit board electrically connected to a tester in order to test a plurality of unpackaged sets of chips, a frame provided on the main circuit board and including a plurality of sockets for respectively receiving the unpackaged sets of chips, probe blocks respectively provided in the sockets and including a plurality of probes electrically connected to input/output terminals of the unpackaged sets of chips, and a cover plate positioned over the frame and including a plurality of pressure members for pressurizing the unpackaged sets of chips in the sockets.