Probe Card Assembly with Nested Passive Components
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Solution Overview
Problem
Existing probe card assemblies lack design flexibility and reliability due to limitations in adjusting the substrate design, leading to inefficiencies in testing semiconductor dies, particularly in preventing IR drop (voltage drop) during wafer sort processes.
Innovation Solution
Incorporating at least one passive component, such as a capacitor, between the circuit board and substrate, which is partially accommodated in openings on either component, providing design flexibility and mitigating IR drop by acting as decoupling/bypassing capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate design is made adjustable to improve testing reliability, then the reliability improves, but the device complexity increases
Solution Approach 1:
The substrate design is segmented into modular components, allowing selective adjustment of specific regions while maintaining overall structural integrity. This enables targeted modifications for testing different semiconductor die configurations without redesigning the entire substrate, thus improving reliability while controlling complexity.
Solution Approach 2:
The substrate incorporates dynamic adjustment mechanisms that allow real-time reconfiguration of testing parameters and probe positions. This dynamic capability enables the substrate to adapt to different testing scenarios, improving reliability through flexible design while using standardized interfaces to manage complexity.
2Reliability
If larger passive components are used to mitigate IR drop, then the reliability improves, but the area occupied increases
Solution Approach 1:
Larger passive components are strategically positioned and nested within existing structural features of the substrate, such as recess areas or regions between probe contact points. This nesting approach allows the use of larger components needed for IR drop mitigation while efficiently utilizing available space and minimizing the overall area occupied.
Solution Approach 2:
The design transitions from two-dimensional planar布局 to three-dimensional spatial arrangement, allowing passive components to be positioned in vertical layers or at angled orientations. This dimensional change enables larger components to be accommodated without increasing the footprint area, maintaining compactness while improving reliability through adequate component sizing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the performance and reliability of the probe card assembly by allowing for adjustments and improvements in the probe card design, while maintaining a compact size and using cheaper, larger passive components effectively.
Implementation Method 1
The at least one passive component is at least partially accommodated in at least one of the first opening and the second opening
Data Source
AI summary
A probe card assembly includes a circuit board, a substrate, and at least one passive component. The substrate is disposed opposite and connected to the circuit board. The circuit board has a first opening facing the substrate and/or the substrate has a second opening facing the circuit board. The at least one passive component is disposed between the circuit board and the substrate and is at least partially accommodated in at least one of the first opening and the second opening.