Probe Card Peltier Cooling for Needle Deformation
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Solution Overview
Problem
In the electrical die sorting process of semiconductor testing, probe needles are prone to deformation and contamination at high temperatures, leading to incorrect chip classification and increased sanding time for impurity removal, which reduces the testing efficiency.
Innovation Solution
A probe card equipped with a thermostat and a Peltier module cooling unit that maintains the probe needles at a controlled temperature, using a temperature detection sensor and controller to manage the cooling process, thereby preventing deformation and minimizing impurity accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wafer is tested at high temperature (80-100°C) to increase operational reliability, then the reliability of chip testing is improved, but the probe needles are heated to high temperature causing deformation and impurity accumulation
Solution Approach 1:
The system is divided into two thermal zones: the wafer maintains high temperature (80-100°C) for reliable testing, while the probe needles are actively cooled to maintain low temperature. This segmentation allows each component to operate at its optimal temperature without mutual interference.
Solution Approach 2:
A cooling unit acts as an intermediary between the high-temperature wafer environment and the probe needles. The cooling unit absorbs heat from the probe needles, preventing them from reaching high temperatures while allowing the wafer to maintain its testing temperature.
2Manufacturing precision
If the probe needles are cooled to prevent deformation and impurity accumulation, then the manufacturing precision and cleanliness are improved, but additional cooling equipment and energy consumption are required
Solution Approach 1:
The system changes the temperature parameter of the probe needles from high (matching wafer temperature) to low (actively cooled), fundamentally altering the thermal state to prevent deformation and impurity accumulation. This parameter change enables precise control of probe needle properties.
Solution Approach 2:
The cooling unit continuously operates to maintain the probe needles at low temperature throughout the testing process. This self-service approach ensures that the probe needles automatically remain at optimal temperature without requiring manual intervention or complex external control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains probe needle temperature, preventing deformation and reducing impurity accumulation, thereby enhancing chip testing efficiency by reducing sanding time and increasing the number of chips that can be tested per unit time.
Implementation Method 1
a cooling unit for lowering the temperature of the probe needle... The cooling unit may include a Peltier module for cooling the probe needle according to a predetermined direct current
Data Source
AI summary
Provided are a probe card, a test apparatus having the probe card, and a test method using the test apparatus. The probe card includes a probe substrate having a signal line, a probe needle connected to the signal line and fixed to the probe substrate, and a cooling unit for cooling the temperature of the probe needle. Therefore, the probe needles contacting each chip can be maintained at a certain low temperature without increasing the temperature. As a result, it is possible to pervent deformation of the probe needles and minimize an amount of impurities stuck to the probe needles.