Probe Card with Pillar Tips for Narrow Pitch Testing
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Solution Overview
Problem
Conventional probe cards with curved probe needles struggle to effectively test semiconductor chip pads with narrow pitches, making it difficult to inspect defects and transmit electrical signals accurately.
Innovation Solution
The use of straight-pillar-shaped or ball-shaped probe tips, combined with multi-layered space converting units and interposer units, allows for precise contact and signal transmission to chip pads with narrow pitches, enabling efficient testing by adjusting the pitch between probe tips to match the chip pad arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional curved probe needles are used, then the probe card can contact chip pads, but it becomes difficult to test contact pads with narrow pitch
Solution Approach 1:
The probe needle shape is changed from curved to straight, and the pitch between probe needles is adjusted to match the narrow pitch of chip pads. This parameter change enables the probe card to effectively test contact pads with narrow pitch while maintaining testing precision.
2Productivity
If probe needles with larger spacing are used, then the probe card structure is simpler, but it cannot contact multiple closely-spaced pads simultaneously
Solution Approach 1:
The probe card utilizes multi-layered space converting units to create vertical dimensionality, allowing probe needles to contact multiple closely-spaced pads simultaneously through different layers. This increases testing efficiency without excessively complicating the overall structure.
3Productivity
If the pitch between probe needles is reduced to match narrow chip pad spacing, then multiple pads can be tested simultaneously, but the area occupied by probe needles increases
Solution Approach 1:
The probe card employs nested multi-layered space converting units where probe needles are arranged in multiple layers. This nesting approach allows multiple pads to be tested simultaneously while compacting the overall probe card area, as probes in different layers can share the same horizontal footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for accurate and reliable testing of semiconductor chip pads with narrow pitches, reducing the area occupied by probe needles and improving the transmission of test signals, thereby enhancing the inspection process.
Implementation Method 1
an interposer unit configured to comprise interposers being located in holes formed in the frame to support the second space converting unit, being electrically connected to the pads of the second space converting unit and providing elasticity
Data Source
AI summary
There is provided a probe card comprising a plurality of probe tips, each being ball-shaped or pillar-shaped and having a top end in contact with each of target chip pads to be tested; a first space converting unit; a second space converting unit; a frame configured to support the second space converting unit; an interposer unit; and a circuit board.