Probe Card Pin Height Uniformity via Adhesive-Free Support
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional probe card devices face issues with inconsistent pin heights due to uneven adhesive distribution, leading to incomplete contact with chip contact pads and a shortened service life due to weak adhesive forces and external forces causing pin detachment.
Innovation Solution
A probe card device with a multi-layered flexible board directly attached to a rigid support plate without intermediate adhesive, ensuring uniform pin heights and strong adhesion, and pins with a copper body and electroless nickel electroless palladium immersion gold coating for enhanced engagement with pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If intermediate adhesive is used to connect the multi-layered flexible board to the support plate, then the board can be attached, but the adhesive distribution is uneven causing inconsistent pin heights
Solution Approach 1:
The patent removes the intermediate adhesive layer from the structure, eliminating the source of uneven pin heights. The multi-layered flexible board is directly connected to the support plate through mechanical engagement features (via holes and positioning structures), achieving both uniform pin heights and reliable connection without requiring adhesive.
Solution Approach 2:
The patent introduces via holes as an intermediary mechanical connection structure between the multi-layered flexible board and the support plate. These via holes provide precise positioning and mechanical anchoring, replacing the adhesive's function while ensuring uniform pin heights through consistent mechanical engagement.
2Duration of action of stationary object
If intermediate adhesive is used to connect the multi-layered flexible board to the support plate, then the board can be attached, but the adhesive force weakens over time causing pins to peel off or break
Solution Approach 1:
The patent eliminates the adhesive layer that degrades over time, replacing it with a permanent mechanical connection through via holes. This mechanical anchoring provides long-term structural integrity and prevents pin detachment or breakage, significantly extending the service life of the probe card device.
Solution Approach 2:
The patent creates a composite structure combining the multi-layered flexible board with the rigid support plate through mechanical interlocking via holes. This composite construction integrates materials with complementary properties, providing both flexibility where needed and rigid support where required, while ensuring durable long-term connection.
3Strength
If intermediate adhesive is used, then the multi-layered flexible board can be connected to the support plate, but the connection strength is insufficient to resist external forces
Solution Approach 1:
The patent removes the weak adhesive connection and replaces it with a robust mechanical connection system using via holes and positioning structures. This provides superior connection strength to resist external forces while actually simplifying the overall structure by eliminating the adhesive layer and associated complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides uniform pin heights, strong adhesion, and improved durability by eliminating the need for intermediate adhesives and utilizing a rigid support plate, ensuring consistent and reliable contact with chip contact pads.
Implementation Method 1
there is an adhesive force between the multi-layered flexible board and the first surface of the support plate
Implementation Method 2
a copper body and electroless nickel electroless palladium immersion gold coating
Data Source
AI summary
A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.