Probe Card Manufacturing with Positioning Members
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Solution Overview
Problem
Conventional probe cards for testing integrated circuits face instability due to looseness between the probe ends and the substrate, leading to relative position changes of probe tips, which prevents high-density arrangement of probes.
Innovation Solution
A method for manufacturing a probe card that involves using plate-like positioning members with through holes to securely position and clamp the probe tips, allowing parallel movement to fix the probes in place, and utilizing a conductive jointing material to secure the attaching portions to the substrate, ensuring stable positioning of probe tips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If probes are inserted through holes in the upper plate and thrust on connecting portions on the supporting substrate, then the probe card structure is simple, but the upper end portion of each probe becomes unstable due to looseness between the upper plate or lower plate and the probes
Solution Approach 1:
The patent introduces positioning members as intermediary components between the probes and the upper plate. These positioning members have through holes that receive the probe tip portions and provide precise positioning and stable support, eliminating the looseness and instability caused by direct insertion into the upper plate.
Solution Approach 2:
The patent replaces the simple mechanical insertion system with a more sophisticated positioning mechanism. The positioning members with precisely dimensioned through holes provide mechanical constraints that stabilize the probes, substituting the inadequate direct thrust-on connection with a controlled positioning and clamping system.
2Ease of manufacture
If probes are loosely inserted in through holes of the upper plate, then the manufacturing process is simple, but the relative position among probe tips changes due to looseness
Solution Approach 1:
The positioning members serve as intermediary components that provide precise positioning during the manufacturing process. The through holes in the positioning members constrain the probe tip portions to specific locations, ensuring accurate relative positioning while maintaining ease of assembly through the modular design.
Solution Approach 2:
The positioning members are prepared in advance with precisely dimensioned through holes that define the exact positions where probe tips should be located. This preliminary preparation of positioning features ensures that when probes are inserted, their relative positions are automatically established with high precision.
3Productivity
If probes are arranged in high-density manner, then the testing capability increases, but the looseness between probes and plates causes instability
Solution Approach 1:
The patent divides the support function into separate components: the upper plate provides structural support, the positioning members provide precise positioning and stability for each probe, and the probes perform the testing function. This segmentation allows high-density arrangement of probes while maintaining stability through the dedicated positioning members.
Solution Approach 2:
The positioning members act as intermediaries that enable high-density probe arrangements by providing individual stabilization for each probe. The through holes in the positioning members constrain the probes at precise intervals, allowing dense packing while preventing the looseness-induced instability that would occur with direct mounting to the upper plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively stabilizes the relative positions of probe tips, enabling high-density arrangement and reducing stress on the probes, thus ensuring accurate and reliable positioning and fixation of probes in the probe substrate.
Implementation Method 1
heating the hot-melt material to a melting point thereof to melt the hot-melt material and thereafter cooling the hot-melt material to solidify the molten hot-melt material
Implementation Method 2
thereafter cooling the hot-melt material to solidify the molten hot-melt material
Data Source
AI summary
A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on a plurality of plate-like positioning members piled in their thickness directions at least in a row, relatively displacing the adjacent positioning members in opposite directions to two-dimensionally position the probe tip portions of the probes, and thereafter softening a conductive jointing material to position the attaching portions of the respective probes against the first through holes.