Probe Card Pressure Chamber Fixing for High-Voltage Testing

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Solution Overview

Problem

Conventional probe cards deform or suffer damage during high-voltage testing due to stress from atmospheric pressure changes, affecting test results and apparatus integrity.

Innovation Solution

A probe card apparatus with a fixing device and air pressure adjusting device that maintains a stable test chamber environment by resisting stress through a fixing device connected to the carrier and probe card, using an air pressure adjusting device to adjust chamber pressure and a fixing device to disperse stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the air pressure in the test chamber is adjusted to suppress point discharge, then the point discharge is suppressed, but the carrier or probe card deforms due to stress

Engineering Contradiction:

Improvepoint discharge suppressionVSAvoidcarrier or probe card deformation

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The fixing device is divided into multiple fixing components (first fixing component on carrier, second fixing component on probe card) that work together to distribute and resist stress. This segmentation allows the stress from pressure changes to be handled by a dedicated fixing mechanism rather than being concentrated on the carrier or probe card structure, preventing deformation while maintaining point discharge suppression.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The fixing device acts as an intermediary element between the carrier and probe card, mediating the stress caused by pressure changes. This intermediary structure absorbs and distributes the mechanical stress, preventing it from being transmitted directly to the carrier or probe card, thus maintaining their structural integrity during high-voltage testing.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the air pressure in the test chamber is increased to two times atmospheric pressure, then the point discharge is suppressed, but the stress on the wafer reaches up to one ton causing deformation or damage

Engineering Contradiction:

Improvepoint discharge suppressionVSAvoidstress on wafer

Core Design Contradiction:

ReliabilityVSForce

Solution Approach 1:

The fixing device is divided into multiple fixing components (first fixing component on carrier, second fixing component on probe card) that work together to distribute and resist stress. This segmentation allows the stress from pressure changes to be handled by a dedicated fixing mechanism rather than being concentrated on the carrier or probe card, preventing deformation while maintaining point discharge suppression.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The fixing device provides beforehand cushioning by being pre-configured to resist stress from pressure changes. The fixing components are designed to absorb and distribute the mechanical stress before it can cause deformation or damage to the carrier, probe card, or wafer, enabling safe operation at elevated pressures.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Strength

If a structurally reinforced mechanism is provided on the circuit board, then the stress resistance is improved, but the device complexity increases

Engineering Contradiction:

Improvestress resistanceVSAvoidcircuit board structure

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The fixing device is divided into multiple fixing components (first fixing component on carrier, second fixing component on probe card) that work together to distribute and resist stress. This segmentation allows the stress from pressure changes to be handled by a dedicated fixing mechanism rather than being concentrated on the carrier or probe card, preventing deformation while maintaining point discharge suppression.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus prevents deformation and damage to the carrier and probe card by dispersing stress, ensuring stable testing conditions and maintaining test chamber integrity.

Implementation Method 1

the test space defined by the probe card and the chuck is usually evacuated or pressurized

Methodology Applied

Scientific EffectGas compression/evacuation: Pressurisation

Implementation Method 2

the test space defined by the probe card and the chuck is usually evacuated or pressurized

Methodology Applied

Scientific EffectVacuum: Vacuum

Implementation Method 3

The fixing device is used to resist the stress

Methodology Applied

Scientific EffectMechanical stress resistance: Mechanical Force

Data Source

PatentUS20260056234A1Probe card apparatus

Publication Date: 2026.02.26 VUETTE PTE LTD

AI summary

A probe card apparatus is provided, which includes a carrier, a probe card, a fixing device, and an air pressure adjusting device. The carrier carries an object to be tested. The probe card includes a plurality of probes, and the plurality of probes are in contact with the object to be tested for testing. The fixing device is connected to the probe card and the carrier. The fixing device, the probe card, and the carrier jointly define a test chamber that is closed. The air pressure adjusting device is spatially communicated with the test chamber and used to adjust an air pressure in the test chamber to a predetermined air pressure. At least one of the carrier and the probe card is subject to a stress at the predetermined air pressure. The fixing device is used to resist the stress to maintain the test chamber that is closed.