Probe Card Reference Resistor Contact Resistance Measurement
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Solution Overview
Problem
Current semiconductor manufacturing processes face challenges in accurately measuring contact resistance of probe cards, leading to unreliable electrical die sorting tests due to the influence of threshold voltages from electrostatic discharge diodes, which affects the precision and reliability of defect detection in semiconductor devices.
Innovation Solution
Incorporating a reference resistor and a ground node with a different reference potential into the probe card system, allowing for precise measurement of contact resistance by applying a specific input potential and measuring the resulting potential, thereby mitigating the effects of threshold voltage distribution and improving the reliability of the electrical die sorting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional probe card without reference resistor is used, then the device complexity is low, but the measurement precision of contact resistance is poor due to threshold voltage influence
Solution Approach 1:
A reference resistor is introduced as an intermediary element between the probe and the device under test. This reference resistor serves as a mediator to separate the measurement of contact resistance from the threshold voltage of the device, allowing accurate contact resistance measurement without being influenced by the device's electrostatic discharge diode characteristics
Solution Approach 2:
The measurement path is segmented into distinct components: the probe, the reference resistor, and the device under test. By dividing the measurement circuit into separate segments, the contact resistance of the probe can be measured independently from the device characteristics, eliminating the threshold voltage interference
2Reliability
If multiple probes with different potentials are used, then the reliability of electrical die sorting is improved, but the device complexity increases
Solution Approach 1:
Multiple ground nodes are provided at different potentials (first ground node at first potential, second ground node at second potential). This equipotentiality principle allows the system to maintain reliable electrical references while accommodating the different potential requirements of various probes, improving measurement reliability without requiring a completely complex redesign
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the precision and reliability of contact resistance measurement, reducing false negatives and improving the overall reliability of semiconductor device testing and manufacturing by accurately determining the operational status of devices under test.
Implementation Method 1
determining a contact resistance of a first probe by connecting the first probe and a second probe to ground pads of a device under test, applying a reference potential to the second probe and applying an input potential to the first probe
Data Source
AI summary
A probe card, a system for manufacturing a semiconductor device, and a method of manufacturing a semiconductor device are provided. A probe card includes a first probe configured to contact a first ground pad of a device under test, a reference resistor including a first terminal and a second terminal and connected to the first probe, and a second probe configured to contact a second ground pad of the device under test, wherein the second probe is further configured to be connected to a ground node for applying a reference potential, and the first terminal of the reference resistor is configured to be connected to the first probe and the second terminal of the reference resistor is configured to receive an input potential.