Probe Card Reinforcement Structure for Warping Prevention
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Solution Overview
Problem
The decreasing thickness of package substrates used as transformers in probe cards leads to structural weakness, causing bending and warping during tests, and uneven force distribution due to inadequate supporting strength.
Innovation Solution
Incorporating a reinforcement structure between the probe head and circuit board, and using transformers with bumps or external contact points to increase the contact area and structural strength, potentially employing encapsulants or interposers to enhance the transformer's thickness and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the package substrate is used as the transformer to reduce cost, then the manufacturing cost is reduced, but the transformer becomes thinner and weaker structurally
Solution Approach 1:
The patent applies composite materials by combining the package substrate with an additional reinforcement layer or structure. The transformer is formed using the package substrate itself, and a reinforcement structure is added to compensate for the reduced thickness, creating a composite structure that maintains both cost-effectiveness and structural strength.
2Volume of moving object
If the package substrate thickness is decreased to reduce size, then the package size is reduced, but bending and warping occur during tests
Solution Approach 1:
The patent addresses the thickness limitation by extending the transformer structure in another dimension - adding a reinforcement structure that protrudes from the package substrate. This dimensional extension compensates for the reduced thickness, providing the necessary structural stability while maintaining compact package size.
3Length of moving object
If the transformer thickness is reduced, then the probe card size is reduced, but the force distribution becomes uneven during tests
Solution Approach 1:
The patent applies local quality by concentrating the reinforcement structure at specific locations where force application occurs during probing. The reinforcement is not uniformly distributed but strategically placed to improve force distribution exactly where needed, while keeping the overall transformer thickness reduced.
Data Source
AI summary
A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.