Probe Card Substrate Assembly for Contact-Safe Detachment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing probe cards suffer from soldering contact breakage due to substrate deformation under normal force, leading to signal transmission issues and increased manufacturing costs during repair and detachment.
Innovation Solution
A probe card design incorporating a first substrate, a second substrate, a first elastic component, and a first adhesive member, with the elastic component positioned between the substrates to absorb deformation and prevent adhesive flow, ensuring easy detachment and reducing contact damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is used to position the periphery of the substrate to prevent soldering contact breakage, then the reliability of soldering contacts is improved, but the adhesive flows into the space between substrate and testing circuit board to enclose soldering contacts, making repair and detachment difficult
Solution Approach 1:
The adhesive is segmented into multiple discrete adhesive members positioned at specific locations between the substrate and testing circuit board, rather than using a continuous adhesive layer. This segmentation prevents the adhesive from flowing into and enclosing the soldering contacts while still providing sufficient bonding strength to prevent substrate deformation and contact breakage during operation.
Solution Approach 2:
An elastic component is introduced as an intermediary element between the substrate and testing circuit board. This elastic component serves as a mediator that prevents direct contact between the adhesive and the soldering contacts, while still allowing the adhesive to fulfill its bonding function. The elastic component acts as a physical barrier that blocks adhesive flow into harmful areas while maintaining the structural integrity needed for reliable operation.
2Strength
If adhesive is applied to prevent substrate deformation under normal force, then the strength of soldering contacts is improved, but the adhesive encloses soldering contacts making manufacturing costs increase due to waste
Solution Approach 1:
The adhesive is applied locally at specific positions between the substrate and testing circuit board rather than uniformly across the entire surface. This localized application ensures that the adhesive provides sufficient bonding strength to prevent substrate deformation under normal force during operation, while minimizing the total amount of adhesive used and preventing waste during manufacturing and repair processes.
3Reliability
If adhesive is used to fill the vertical gap between substrate and testing circuit board, then the reliability of soldering contacts is improved, but the adhesive flow increases the complexity of detachment procedures
Solution Approach 1:
The adhesive is divided into multiple discrete adhesive members positioned at specific locations rather than forming a continuous mass. This segmentation allows for simpler detachment procedures as the adhesive can be more easily separated from the soldering contacts and substrate, reducing the complexity of repair and maintenance operations while maintaining sufficient bonding strength for reliable signal transmission during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents soldering contact breakage and facilitates easy repair by minimizing adhesive flow and substrate deformation, thereby reducing manufacturing costs and improving reliability.
Implementation Method 1
a first elastic component, and a first adhesive member. The first elastic component is disposed between the upper surface of the first substrate and the lower surface of the second substrate
Implementation Method 2
The first adhesive member is disposed on an upper surface of the first substrate, annularly arranged on the side surface of the second substrate
Data Source
AI summary
A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.