Probe Card Thermal Deformation Control via Segmented Reinforcement
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Solution Overview
Problem
Conventional probe test processes face misalignment issues due to thermal deformation of the reinforcing plate caused by excessive heat transfer from the circuit board, leading to contact failures between the probe and the object being tested.
Innovation Solution
A probe card design that minimizes the contact area between the circuit board and the reinforcing plates by using adjustable gaps and a spacing member, which reduces heat transfer and maintains probe alignment despite thermal deformation of the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a large contact area between the circuit board and the reinforcing plate is used, then the reinforcing plate can effectively prevent thermal deformation and deflection of the circuit board, but a large amount of heat is transferred between the circuit and the reinforcing plate, causing the circuit board to deflect and the reinforcing plate to deform
Solution Approach 1:
The reinforcing plate is divided into multiple separate reinforcing members (first reinforcing member, second reinforcing member, third reinforcing member) instead of a single large plate. These segmented members are positioned at different locations on the circuit board, providing distributed support while minimizing total contact area and heat transfer.
Solution Approach 2:
The reinforcing members are strategically positioned at specific locations on the circuit board where support is most needed. The first reinforcing member is on the upper surface, the second reinforcing member is on the lower surface, and the third reinforcing member connects them vertically, creating localized reinforcement zones rather than uniform coverage.
2Reliability
If the reinforcing plate is deformed due to heat transfer, then misalignment of the probe occurs, but the probe must maintain precise alignment with the object being tested
Solution Approach 1:
The probe card is divided into functionally independent components: the circuit board, multiple reinforcing members, and the probe assembly. This segmentation isolates the probe assembly from thermal deformation of the circuit board, as the reinforcing members bear the thermal load separately from the probe positioning structure.
Solution Approach 2:
The third reinforcing member acts as an intermediary structure that mechanically connects the first reinforcing member on the upper surface to the second reinforcing member on the lower surface. This intermediary provides structural stability and maintains spacing between surfaces, preventing misalignment of the probe while allowing thermal expansion to occur in the reinforcing members rather than the probe assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances thermal deformation resistance, reducing heat transfer and maintaining probe alignment, thereby preventing contact failures and ensuring accurate electrical testing of semiconductor substrates.
Implementation Method 1
a contact area between the circuit board and first and second reinforcing plates may be minimized, thereby reducing high heat transfer in a test environment
Data Source
AI summary
A probe card includes a probe, a circuit board, a first reinforcing plate and a second reinforcing plate. The probe makes contact with an object. The circuit board is electrically connected to the probe. The first reinforcing plate has a first tap and a second tap for providing an adjustable gap between the first reinforcing plate and an upper surface of the circuit board. The second reinforcing plate is positioned under a lower surface of the circuit board. The second reinforcing plate combined with the second tap to form an adjustable gap between the second reinforcing plate and a lower surface of the circuit board.