3D Probe Card Signal Transfer Structure for High-Frequency Testing
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Solution Overview
Problem
Conventional probe cards have limitations in design and functionality, hindering significant progress in their development, and are costly to produce and assemble.
Innovation Solution
A three-dimensional signal transfer structure for a probe card device, comprising a transfer plate, a supporting frame, and a guiding plate, which defines a receiving space for conductive probes with elastic and connecting segments, allowing for higher frequency signal transmission and reduced production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional probe card configuration is used, then structural stability is maintained, but development progress is limited and production costs are high
Solution Approach 1:
The probe card structure is divided into modular components: a body portion containing signal circuits, a supporting frame with through-holes, and a guiding plate. This segmentation allows independent manufacturing and assembly of each module, reducing overall production complexity and cost while maintaining functional integrity.
Solution Approach 2:
The supporting frame and guiding plate are integrated into a unified structure where the guiding plate is disposed on the supporting frame. This merging reduces the number of separate components and assembly steps, thereby lowering production costs and simplifying the manufacturing process.
2Speed
If longer probes are used in conventional probe cards, then signal transmission for lower frequencies is achieved, but signal transmission for higher frequencies is limited
Solution Approach 1:
The patent changes the physical parameters of the signal transmission path by reducing probe length and optimizing the spatial arrangement of signal circuits and through-holes. This parameter optimization enables higher frequency signal transmission by minimizing signal attenuation and interference that occur with longer probe lengths.
Solution Approach 2:
The patent transitions from a conventional two-dimensional signal transmission path to a three-dimensional arrangement where signal circuits are positioned on the body portion and connect to probes through vertically arranged through-holes in the supporting frame. This dimensional change shortens the effective signal path length while maintaining connection integrity, enabling higher frequency operation.
3Ease of manufacture
If conventional probe card assembly process is used, then structural integrity is maintained, but assembly complexity and costs increase
Solution Approach 1:
The signal circuits are pre-positioned on the body portion and the through-holes are pre-formed in the supporting frame during separate manufacturing stages. This preliminary action allows each component to be manufactured and tested independently before final assembly, simplifying the overall assembly process while ensuring structural integrity through pre-validated connections.
Solution Approach 2:
The body portion acts as an intermediary structure that houses the signal circuits and provides connection points for the probes. This intermediary structure simplifies assembly by providing a centralized interface between the signal generation layer and the probe connection layer, reducing the complexity of direct probe-to-signal-path connections while maintaining reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D signal transfer structure simplifies the assembly process, reduces costs, and enables the use of shorter probes for higher frequency signal transmission, providing a new development direction for probe card technology.
Implementation Method 1
The conductive probes each have an elastic segment, a detecting segment, and a connecting segment
Data Source
AI summary
A three-dimensional (3D) signal transfer structure of a probe card device includes a transfer plate, a supporting frame, and a guiding plate. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a plurality of signal circuits each having a signal contact arranged on the first surface. The supporting frame is abutted against and fixed onto the first surface of the transfer plate. A portion of the first surface abutted against the supporting frame is arranged outside the signal contacts. The guiding plate has a plurality of thru-holes and is disposed on the supporting frame. The guiding plate, the supporting frame, and the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.