Cantilever Probe Card Structure for Solder Climb Restriction
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Solution Overview
Problem
Conventional cantilever probe cards face issues with solder climbing at different heights, leading to instability in the soldering process.
Innovation Solution
The introduction of climb-restricting probes with a climb-restricting ring that blocks solder from climbing past a specific height, ensuring precise control over soldering stability by integrating a substrate with soldering pads and climb-restricting probes featuring a main segment, arm segment, testing segment, and a climb-restricting ring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cantilever probes are used without climb-restricting rings, then the probe structure is simple, but the solder climbing causes instability in the soldering process
Solution Approach 1:
The probe is divided into multiple functional segments: arm segment, main segment, and testing segment. The climb-restricting ring is positioned on the main segment to specifically address solder climbing at critical heights, while maintaining the overall probe functionality. This segmentation allows targeted control of solder climbing without affecting the entire probe structure.
Solution Approach 2:
The climb-restricting ring acts as an intermediary element between the solder and the probe surface. It creates a physical barrier that mediates the interaction between solder and the probe, preventing direct contact and controlling the climbing height of the solder through its restriction height parameter.
2Manufacturing precision
If the climb-restricting ring has a larger restriction height, then solder climbing is better controlled, but the manufacturing precision requirements increase
Solution Approach 1:
The invention optimizes the restriction height parameter of the climb-restricting ring to a specific range (3 μm to 50 μm). This parameter optimization balances the control effectiveness over solder climbing with the manufacturability of the probe. The main segment length is also controlled within 5 μm to 50 μm to maintain compatibility with existing manufacturing capabilities while achieving precise soldering height control.
Data Source
AI summary
A climb-restricting probe includes an arm segment, a main segment located at one side of the arm segment, a testing segment connected to another side of the arm segment, and a climb-restricting ring. The main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction. The testing segment has an upright shape along the predetermined direction. The climb-restricting ring surrounds the main segment along a top edge of the soldering end portion and protrudes from an outer surface of the main segment. The climb-restricting ring has a restriction height along the predetermined direction. The restriction height is within a range from 3 μm to 50 μm. The climb-restricting ring can block a solder from climbing past the climb-restricting ring along the predetermined direction.