Probe Card High-Speed Signal Isolation via Space Transformer
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Solution Overview
Problem
The challenge lies in accurately testing semiconductor devices with smaller dimensions and increasingly complex designs, particularly in handling high-speed signals that are vulnerable to external interference due to improper impedance matching in existing testing equipment.
Innovation Solution
A probe card device comprising a printed circuit board, a space transformer, and a high-speed flexible printed circuit, where the space transformer has general and high-speed contact pads, and the flexible printed circuit delivers signals above 10 GHz, addressing signal interference by isolating high-speed signals from general signals and optimizing pitch configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-speed signals are transmitted through signal paths among different interfaces in the testing equipment, then signal transmission is enabled, but signal quality deteriorates due to external interference and improper impedance matching
Solution Approach 1:
The probe card device is segmented into distinct general signal paths and high-speed signal paths. The high-speed flexible printed circuit board separately transmits high-speed signals from the general printed circuit board that transmits standard signals, preventing interference between different signal types and maintaining signal quality.
Solution Approach 2:
A space transformer is introduced as an intermediary component between the printed circuit board and the high-speed flexible printed circuit board. It performs impedance matching and signal transformation, acting as a buffer that protects high-speed signals from interference while enabling proper signal transmission.
2Measurement precision
If probes are carefully arranged to be independent and aligned with contact pads, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The probe card device utilizes a three-dimensional structure with multiple layers including the printed circuit board, space transformer, and high-speed flexible printed circuit board. This dimensional arrangement allows probes to be precisely positioned and independent from each other while managing complexity through spatial organization rather than planar arrangement.
Data Source
AI summary
A probe card device includes a printed circuit board (PCB), a space transformer, and a high-speed flexible printed circuit (FPC). The PCB includes a plurality of first connecting bodies coupled to a tester, and a plurality of second connecting bodies. The space transformer includes a plurality of connecting bodies disposed on a first surface of the space transformer and coupled to the plurality of second connecting bodies of the printed circuit board, a plurality of general contact pads disposed on a second surface of the space transformer and contacted with a plurality of first probes, and a plurality of high-speed contact pads disposed on the second surface of the space transformer and contacted with a plurality of second probes. The high-speed FPC has a first connecting terminal coupled to the tester, and a second connecting terminal coupled to the plurality of high-speed contact pads.


