Probe Card Stroke Compensation via Measured Flatness

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Solution Overview

Problem

Existing probe card systems in semiconductor wafer testing struggle to ensure effective contact between probes and wafer pads, leading to yield and reliability issues due to inadequate stroke compensation.

Innovation Solution

A probe card stroke compensation system that includes a measuring unit to assess probe stroke and flatness, and a pressure sensor unit to calculate and adjust the stroke compensation value, ensuring accurate and reliable contact between probes and wafer pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the probe stroke is increased to ensure effective contact between probe and wafer pad, then the contact reliability is improved, but the probe card structural strength and precision requirements worsen

Engineering Contradiction:
Improvecontact reliabilityVSAvoidprobe card structural strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The system performs preliminary measurement of probe stroke and flatness before actual testing, calculates the required compensation value in advance, and pre-adjusts the probe card position to ensure effective contact without requiring excessive structural strength during testing

Inventive Principle:
Principle #10Preliminary action

2Productivity

If the number of probes is increased to meet high-density market demand, then the productivity is improved, but the total thrust requirement and device complexity worsen

Engineering Contradiction:
Improvewafer testing capacityVSAvoidprobe card complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The system divides the probe card into multiple probe units, each with individual stroke measurement and compensation capabilities. The measuring unit and pressure sensor unit are segmented to work independently on different probe regions, allowing high probe counts without proportionally increasing overall system complexity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system changes the control parameter from direct mechanical thrust control to stroke-based compensation control. By measuring and compensating individual probe stroke parameters, the system can handle high probe densities without requiring proportional increases in total thrust capability

Inventive Principle:
Principle #35Parameter changes

3Force

If the probe elastic force is increased to ensure effective contact, then the contact pressure is improved, but the probe deformation and stroke requirements worsen

Engineering Contradiction:
Improveprobe elastic forceVSAvoidprobe stroke
Core Design Contradiction:
ForceVSLength of moving object

Solution Approach 1:

The system uses pressure sensors to provide feedback on actual contact force, which is then used to adjust and compensate probe stroke in real-time. This feedback mechanism ensures adequate contact pressure without requiring excessive probe deformation or stroke

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively compensates for probe stroke, ensuring consistent and reliable electrical contact, thereby improving the yield and reliability of semiconductor wafer testing.

Implementation Method 1

a pressure sensor unit, the pressure sensor and the probe head can be replaced with each other, and the stroke compensation value of the probe card is obtained according to the relationship between the pressure and the stroke measured by the pressure sensor

Methodology Applied
Scientific EffectPressure sensing:

Implementation Method 2

After the probe is stuck on the wafer pad, it is necessary to continue to apply pressure to make the probe deform and generate greater elastic force, thus ensuring the electrical contact between the probe and the pad

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS20250164527A1A Probe Card Stroke Compensation System and Method
Publication Date: 2025.05.22 SHANGHAI ZENFOCUS SEMI-TECH CO LTD
  • US20250164527A1 patent drawing
  • US20250164527A1 patent drawing
  • US20250164527A1 patent drawing

AI summary

The invention provides a probe card stroke compensation system, which can be applied to a wafer testing system, and that probe card in the wafer testing system includes a probe head, comprising a measuring unit, which is used for measuring the stroke of a single probe and the flatness of all probes, and allows to calculate the total elastic force of the probe card according to the numerical values of the stroke and flatness; a pressure sensor unit, wherein that pressure sensor and the probe head can be replaced each other, and the stroke compensation value of the probe card is obtained according to the relationship between the pressure and the stroke measured by the pressure sensor. The invention also provides a probe card stroke compensation method correspondingly.