Probe Card Substrate Bonded Via Design
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Solution Overview
Problem
Current probe card assembly manufacturing processes are time-consuming and costly due to the serial approach of designing and fabricating probe contactor substrates and space transformers, which are often made from suboptimal materials like LTCC/HTCC substrates that lack ideal surface quality and strength, requiring additional modifications and complexity.
Innovation Solution
A probe card assembly design that allows for the simultaneous fabrication of probe contactor substrates and space transformers using separate substrates with slots or holes, enabling the use of different materials for each component and reducing manufacturing time by decoupling their production processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If probe contactor substrate and space transformer are fabricated using the same material (LTCC/HTCC), then manufacturing process is simplified, but surface quality and strength are insufficient requiring additional modifications
Solution Approach 1:
The invention divides the probe card assembly into two separate substrates: a probe contactor substrate and a space transformer substrate. Each substrate can be manufactured from different materials optimized for its specific function. The probe contactor substrate uses materials with superior surface quality for precise probe contactor placement, while the space transformer substrate uses materials optimized for electrical interconnection. This segmentation resolves the contradiction by allowing each component to have optimal material properties without compromising manufacturing simplicity.
2Adaptability or versatility
If probe contactor substrate and space transformer are fabricated separately, then material selection freedom increases, but device complexity increases
Solution Approach 1:
The invention merges the probe contactor substrate and space transformer substrate into a single integrated assembly through precise alignment and bonding. The slots in the probe contactor substrate align with vias in the space transformer substrate, creating a unified structure that functions as both a mechanical support and an electrical interconnect system. This merging reduces assembly complexity while maintaining the freedom to select different materials for each substrate, as the bonding process is standardized.
3Manufacturing precision
If serial manufacturing approach is used for probe contactor substrate and space transformer, then manufacturing quality is maintained, but manufacturing time increases
Solution Approach 1:
The invention enables preliminary fabrication of both the probe contactor substrate and space transformer substrate in parallel before final assembly. The slots in the probe contactor substrate and vias in the space transformer substrate can be manufactured simultaneously using standardized processes. This preliminary action maintains fabrication quality through proven manufacturing techniques while significantly reducing total manufacturing time by eliminating sequential dependencies.
4Ease of manufacture
If LTCC/HTCC substrates are used for probe contactor substrate, then via redistribution is enabled, but surface quality and mechanical strength are compromised
Solution Approach 1:
The invention segments the functional requirements by placing the via redistribution function exclusively in the space transformer substrate made from LTCC/HTCC materials, while the probe contactor substrate is made from materials with superior mechanical strength and surface quality. The slots in the probe contactor substrate provide mechanical support and positioning, while the vias in the space transformer substrate handle electrical redistribution. This segmentation allows each substrate to be optimized for its primary function without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces manufacturing time by up to 50% and allows for the selection of materials with more desirable qualities for each function, improving surface quality and strength without adding complexity, while maintaining planarity and mechanical integrity.
Implementation Method 1
The probe contactor substrate is joined to the space transformer substrate with the conductive adhesive accessible through the slots
Data Source
AI summary
The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.