Probe Card Support Apparatus Planarization Top-Loading

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Solution Overview

Problem

Conventional automatic test equipment experiences probe card distortion due to temperature and mechanical forces, leading to alignment errors between the probe array and the wafer chuck, which compromises testing accuracy, especially for larger probe cards, and existing support apparatuses often restrict top-loading of probe cards.

Innovation Solution

A probe card support apparatus that provides stiffening support and planarization to the probe card, allowing it to be used with both top-load and bottom-load wafer probers without interfering with loading, by being connected to the probe card or integrated into the automated test unit, ensuring accurate alignment and reducing distortion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional support apparatus is attached to the wafer prober to reduce probe card distortion, then probe card planarity is improved, but the probe card cannot be loaded from the top due to the support apparatus spanning the top center opening

Engineering Contradiction:

Improveprobe card planarityVSAvoidprobe card loading

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The support apparatus is divided into multiple separate support structures positioned at the periphery of the probe card rather than a single spanning structure. This segmentation allows the probe card to be loaded from the top while still providing distributed support to maintain planarity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support apparatus is repositioned from the top center (blocking the loading path) to the peripheral areas (below or beside the loading path). This spatial reconfiguration in another dimension allows both top-loading capability and probe card support to coexist.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If the probe card size is increased to accommodate larger DUT areas, then testing coverage is improved, but probe card distortion and alignment errors increase due to greater deflection of the unsupported central portion

Engineering Contradiction:

Improveprobe card areaVSAvoidalignment accuracy

Core Design Contradiction:

Area of stationary objectVSManufacturing precision

Solution Approach 1:

Support is provided specifically at the peripheral regions of the probe card where the support structures are positioned, rather than uniform support across the entire card. This localized support at critical perimeter points prevents edge warping that would cause central deflection and alignment errors.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The support apparatus is pre-positioned and attached to the probe card before the probing operation begins. This preliminary support establishment prevents distortion from developing during the testing process, maintaining alignment accuracy throughout the operation.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS11022628B2Probe card support apparatus for automatic test equipment

Publication Date: 2021.06.01 REID ASHMAN MFG

AI summary

Various implementations of automatic test equipment are disclosed having a number of innovative features. In one implementation, the equipment includes a test head having a probe card support apparatus that provides stiffening support and/or planarization to the device under test (DUT) area of a probe card. In another implementation, the test head can include a planar surface and the wafer prober can include a corresponding planar surface. The planar surfaces can be brought into contact with each other to planarize the DUT area of the probe card and the wafer chuck in the wafer prober relative to each other.