Probe Card Switch Module Uniform Wire Length Signal Integrity
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Solution Overview
Problem
The existing spatial transform devices for probe cards and IC carrier plates face challenges in maintaining signal integrity due to wire intersections and varying wire lengths, leading to signal interference and inaccurate electrical testing results.
Innovation Solution
A switch module with a microhole plate, switch plate, and positioning film is designed to ensure wires have uniform lengths and are aligned correctly, preventing intersections and enhancing signal accuracy by using a base, microhole plate, and switch plate configuration with specific contact point distributions and inner layer circuit layouts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spatial transform device is used to enlarge the spatial distribution of contact points, then the electrical connection between probes and test circuit board is improved, but wire intersections and varying wire lengths cause signal interference and inaccurate testing results
Solution Approach 1:
The spatial transform device is divided into multiple functional layers: a first circuit board with first contact points, a second circuit board with second contact points, and a switching module with switching contact points. This segmentation allows independent optimization of each layer's contact point distribution while maintaining overall signal integrity through controlled wiring paths.
Solution Approach 2:
The switching module acts as an intermediary component between the first and second circuit boards. It provides switching contact points that can be selectively connected to either the first or second circuit board, enabling flexible signal routing that avoids wire intersections and maintains uniform wire lengths, thereby preventing signal interference.
2Adaptability or versatility
If probes are arranged in a dense configuration to match the contact points on dies, then the probe distribution matches the die contact point distribution, but the direct electrical connection to the test circuit board becomes difficult due to narrow distances between contact points
Solution Approach 1:
The invention transitions from a two-dimensional dense probe arrangement on a single plane to a three-dimensional multi-layer structure. The first circuit board provides dense contact point distribution for probe matching, while the second circuit board provides spaced contact points for easy electrical connection to the test circuit board, achieving both requirements simultaneously through vertical stacking.
Solution Approach 2:
The probe card structure is segmented into multiple circuit boards with different contact point distributions. The first circuit board matches the dense probe arrangement, while the second circuit board provides a spaced-out contact pattern that facilitates reliable electrical connections to the test circuit board, resolving the contradiction between matching probe distribution and enabling electrical connection.
Data Source
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AI summary
A switch module (10, 20) and a probe card (30) are provided. The probe card (30) includes a test circuit board (31), a reinforcement member (32), a switch module (10, 20), and a test head (35). The test circuit board (31) includes an upper surface (31U), a lower surface (31B), and a central hole (311). The reinforcement member (32) is on the upper surface (31U) of the test circuit board (31) and includes a central carrier (321) corresponding to the central hole (311). The switch module (10, 20) includes a base (11), a micropore plate (12), and a switch plate (13, 23). The base (11) includes a hollow portion (111). The micropore plate (12) is below the base (11) and the switch plate (13) is above the base (11). The micropore plate (12) includes first micropores (121) facing the hollow portion (111) of the base (11). The switch plate (13, 23) includes a top surface (13U) and a bottom surface (13B). The top surface (13U) includes upper contact points (131). The test head (35) is electrically connected to the micropore plate (12).