Probe Card Temperature Control for Thermal Deformation
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Solution Overview
Problem
Existing probe cards face challenges in quickly and accurately providing high and low temperatures for testing semiconductor substrates, leading to thermal deformation and unreliable test results due to prolonged temperature setting times.
Innovation Solution
A probe card with a multi-layered substrate and a temperature controlling unit that includes heating and cooling members, such as heating blocks and cooling passageways, and a thermoelectric module, allowing for rapid temperature adjustments using the Peltier effect to minimize pre-heating and pre-cooling times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heating and cooling methods are used to provide high and low temperatures to the probe card, then the temperature can be changed, but the time required for temperature adjustment is long
Solution Approach 1:
The patent incorporates heating and cooling members directly into the probe card structure in advance, allowing rapid temperature adjustment when needed. The heating member (heating block with heating coil) and cooling member (cooling block with cooling passageway) are pre-installed, eliminating the need for external temperature control equipment and enabling quick response to temperature change requirements.
Solution Approach 2:
The patent introduces a temperature controlling unit as an intermediary device that directly manages the temperature of the probe card. This unit includes heating and cooling members that act as mediators between the power source and the probe card, enabling precise and rapid temperature control without relying on environmental conditions or indirect heating methods.
2Adaptability or versatility
If high and low temperatures are repeatedly provided to the semiconductor substrate and probe card, then temperature testing can be performed, but thermal deformation occurs causing inaccurate needle contact
Solution Approach 1:
The patent separates the temperature control function from the testing function by providing dedicated heating and cooling members. This segmentation allows independent control of temperature conditions without affecting the structural integrity and needle positioning of the probe card, enabling repeated temperature cycling without cumulative thermal deformation.
Solution Approach 2:
The patent designs the probe card with integrated temperature control members that can compensate for thermal effects before they cause damage. The heating and cooling members are positioned to provide uniform temperature distribution, preventing localized thermal stress that could lead to deformation and maintaining needle contact accuracy throughout temperature cycling.
3Productivity
If repeated temperature cycling is performed on the probe card and semiconductor substrate, then comprehensive electrical characteristics can be tested, but damages to the semiconductor substrate may occur
Solution Approach 1:
The patent enables rapid temperature transitions by having heating and cooling members ready in advance within the probe card structure. This preliminary preparation allows the system to quickly reach test temperatures and maintain them for minimal durations, reducing the total time subjects are exposed to extreme temperatures and thereby minimizing thermal damage risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the probe card to reach desired high or low temperatures in a short time, reducing thermal deformation and improving the reliability of test results by shortening temperature setting times.
Implementation Method 1
The heating member may include a heating block built in the multi-layered substrate, and a heating coil built in the heating block
Implementation Method 2
The cooling member may include a cooling block built in the multi-layered substrate. The cooling block may include a cooling passageway through which a cooling fluid may pass
Implementation Method 3
A probe card with a multi-layered substrate and a temperature controlling unit that includes heating and cooling members, such as heating blocks and cooling passageways, and a thermoelectric module, allowing for rapid temperature adjustments using the Peltier effect
Data Source
AI summary
A probe card including a multi-layered substrate, a plurality of needles, and a temperature controlling unit may be provided. The multi-layered substrate may include a test pattern through which a test current passes. The needles may be provided on the multi-layered substrate. The needles may be electrically connected to the test pattern and may be configured to contact an object so that the test current may be supplied to the object. The temperature controlling unit may provide the multi-layered substrate with at least one of a first temperature and a second temperature, the first temperature being higher than the second temperature. Thus, a time for setting a test temperature may be shortened. As a result, thermal deformation of the probe card and/or the object may be reduced or suppressed, and thus reliability of test result may be improved.