Probe Card Temperature Stabilization via Intermediate Connection Member

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing inspection apparatuses face challenges in performing accurate electrical characteristics inspections at varying temperatures due to thermal expansion differences between semiconductor wafers and probe cards, leading to relative position deviations and increased costs from embedding thermocouples and heaters in probe cards, as well as lengthy temperature adjustment times without them.

Innovation Solution

An inspection apparatus with a stage-mounted temperature adjustment mechanism, a probe card, an intermediate connection member with a temperature measurement member, and a controller that adjusts the probe card's temperature before inspection, determining stabilization based on the intermediate connection member's temperature, eliminating the need for temperature adjustment mechanisms in the probe card.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If temperature adjustment mechanisms (thermocouples and heaters) are embedded in the probe card, then temperature control accuracy is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:

Improvetemperature control accuracyVSAvoidprobe card structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent introduces a temperature measurement member installed in the intermediate connection member as an intermediary to measure the probe card's temperature. This indirect measurement approach eliminates the need for embedding thermocouples and heaters directly in the probe card, thereby reducing probe card complexity while maintaining temperature control capability through the stage-mounted temperature adjustment mechanism.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of time

If temperature adjustment mechanisms are embedded in the probe card, then temperature stabilization speed is improved, but manufacturing cost increases

Engineering Contradiction:

Improvetemperature adjustment timeVSAvoidprobe card manufacturing cost

Core Design Contradiction:

Loss of timeVSEase of manufacture

Solution Approach 1:

The patent extracts the temperature adjustment mechanisms from the probe card and relocates them to the stage. This separation allows the probe card to be manufactured without complex temperature control components, reducing manufacturing cost, while the stage-mounted mechanisms handle the temperature adjustment function externally.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The intermediate connection member serves as a mediator that thermally connects the stage-mounted temperature adjustment mechanism to the probe card, enabling efficient heat transfer without requiring direct embedding of temperature control components in the probe card structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Measurement precision

If the probe card is pre-heated to match inspection target temperature, then measurement precision is improved, but inspection time increases

Engineering Contradiction:

Improveelectrical characteristics measurement accuracyVSAvoidinspection throughput

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The patent replaces the conventional mechanical embedding of thermocouples and heaters in the probe card with a non-contact or indirect heating approach using stage-mounted mechanisms. This substitution enables faster thermal response and more efficient heat transfer to the probe card through the intermediate connection member, reducing pre-heating time while maintaining measurement precision.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate electrical characteristics inspections under various temperature conditions in a short time and at a lower cost by optimizing temperature adjustment and stabilization processes without requiring temperature adjustment mechanisms in the probe card.

Implementation Method 1

a temperature measurement member installed in the intermediate connection member and configured to measure a temperature of the intermediate connection member

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a temperature adjustment mechanism installed in the stage and configured to adjust a temperature of the stage

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentUS11092641B2Inspection apparatus and inspection method

Publication Date: 2021.08.17 TOKYO ELECTRON LTD

AI summary

An inspection apparatus includes: a stage on which an inspection target is mounted; a temperature adjustment mechanism configured to adjust a temperature of the stage; an inspecting part configured to exchange electrical signals for an electrical characteristics inspection with the inspection target; a probe card having terminals in contact with the inspection target; an intermediate connection member having connectors electrically connecting the inspecting part and the probe card; a position adjustment mechanism configured to adjust a relative position between the stage and the probe card; a temperature measurement member configured to measure a temperature of the intermediate connection member; a preliminary temperature adjusting part configured to adjust a temperature of the probe card prior to the electrical characteristics inspection; and a determining part configured to determine whether or not the temperature of the probe card is stabilized, based on the temperature of the intermediate connection member.