Probe Card Thermal Conduction Structure for High-Power Test Cooling

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Solution Overview

Problem

Existing probe cards fail to effectively dissipate heat generated during high-power electrical tests, leading to temperature control issues that affect test precision and potentially damage semiconductor devices, with air-cooling technologies being inadequate.

Innovation Solution

A probe card equipped with a thermal conduction device featuring crossed first and second walls forming receiving spaces for probe assemblies, allowing direct contact between the probe assemblies and the thermal conduction device for efficient heat dissipation through heat conduction paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If high electric power is used for electrical tests, then test capability is improved, but heat generation increases causing temperature control issues and test precision deterioration

Engineering Contradiction:

Improveelectric powerVSAvoidprobe card temperature

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent converts the harmful heat generated during high-power electrical tests into a beneficial cooling mechanism. The thermal conduction device with receiving spaces and cooling channels directs cooling air to flow through spaces adjacent to the probe assemblies, transforming the heat problem into an opportunity for efficient thermal management that maintains test precision under high-power conditions

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent introduces a thermal conduction device as an intermediary between the probe assemblies and the cooling system. This device includes cooling channels and receiving spaces that act as a thermal interface, efficiently transferring heat from the probe assemblies to the cooling air flow while maintaining electrical isolation and structural integrity

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If air-cooling technology is used for probe array blocks, then cooling is provided, but heat dissipation from individual probes is insufficient

Engineering Contradiction:

Improvecooling effectivenessVSAvoidtest precision

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies local quality by providing targeted cooling to each probe assembly through individual receiving spaces within the thermal conduction device. Instead of uniform air cooling of the entire probe array block, the design directs cooling air specifically to the regions adjacent to each probe assembly, enabling localized heat dissipation that maintains optimal temperature for each probe during high-power testing

Inventive Principle:

Principle #3Local quality

3Temperature

If ambient temperature is increased to handle heat, then heat dissipation capacity improves, but temperature control precision deteriorates

Engineering Contradiction:

Improveambient temperatureVSAvoidtest precision

Core Design Contradiction:

TemperatureVSMeasurement precision

Solution Approach 1:

The patent implements continuous active cooling through the thermal conduction device during high-power electrical tests. The cooling air flow through the receiving spaces and cooling channels operates continuously to counteract heat generation in real-time, maintaining stable ambient temperature conditions around the probe assemblies throughout the testing process rather than relying on passive temperature increases

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances temperature control precision by effectively dissipating heat generated during high-power tests, preventing probe assembly deformation and ensuring accurate test results.

Implementation Method 1

a plurality of heat conduction paths are provided between the thermal conduction device and the cases of the probe assemblies

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS12498397B2Probe card and thermal conduction device thereof

Publication Date: 2025.12.16 STAR TECHNOLOGIES INC

AI summary

The present disclosure provides a probe card and a thermal conduction device thereof. The thermal conduction device includes a plurality of first walls and a plurality of second walls. The first walls and the second walls are crossly arranged to form a plurality of accommodation spaces. The probe assemblies are disposed in the accommodation spaces. Each probe assembly includes a plurality of probes and a case which is configured to accommodate the probes. First ends of the probes face toward an opening of the corresponding accommodation space. Second ends of the probes face toward another opening of the corresponding accommodation space.