Probe Card Testing Device Eliminating Solder and Primer
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Solution Overview
Problem
Current probe card testing devices rely on solder and primer, which increases manufacturing costs and alignment accuracy issues due to finer chip-pad pitches, and reduces bonding yield.
Innovation Solution
A probe card testing device design that eliminates the use of solder and primer by employing a connecting structure layer with conductive vias and a thermocompression bonding process, along with a fixing plate and probe head configuration that ensures alignment and bonding without these materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder and primer are used to connect the space transformer and test printed circuit board, then structural reliability is improved, but manufacturing cost increases and alignment accuracy deteriorates
Solution Approach 1:
The patent removes solder and primer from the connection process between the space transformer and test printed circuit board. Instead, it uses a ball grid array with spherical body material (such as soft solder) that is directly connected through the ball grid array structure, eliminating the need for traditional soldering and priming processes while reducing manufacturing complexity and cost.
2Reliability
If solder and primer are used to connect the space transformer and test printed circuit board, then structural reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent eliminates the multi-step process of applying primer followed by soldering by using a ball grid array structure where spherical bodies directly establish electrical and mechanical connections. This extraction of unnecessary materials and processes simplifies the manufacturing workflow while maintaining connection reliability.
3Ease of manufacture
If traditional connection methods are used, then manufacturing process is simpler, but alignment accuracy between test probe head and test printed circuit board deteriorates due to finer chip-pad pitches
Solution Approach 1:
The patent divides the connection system into modular components: the space transformer with ball grid array, the test printed circuit board with corresponding pads, and the test probe head. This segmentation allows each component to be optimized independently, with the ball grid array providing precise alignment features that accommodate finer chip-pad pitches while maintaining overall manufacturing simplicity.
Data Source
AI summary
A probe card testing device includes a first sub-circuit board, a second sub-circuit board, a connecting structure layer, a fixing plate, a probe head and a plurality of conductive probes. The first sub-circuit board is electrically connected to the second sub-circuit board by the connecting structure layer. The fixing plate is disposed on the second sub-circuit board and includes an opening and an accommodating groove. The opening penetrates the fixing plate and exposes a plurality of pads on the second sub-circuit board. The accommodating groove is located on a side of the fixing plate relatively far away from the second sub-circuit board and communicates with the opening. The probe head is disposed in the accommodating groove of the fixing plate. The conductive probes are set on the probe head and in the opening of the fixing plate. One end of the conductive probes is in contact with the corresponding pads, respectively.