Probe Card Alignment via Thermal Compensation
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Solution Overview
Problem
There is a continuous need to precisely control the alignment of a probe card in semiconductor testing without extensive human intervention, as traditional methods rely heavily on manual adjustments and are prone to inaccuracies due to temperature changes affecting probe alignment.
Innovation Solution
A method involving a chuck, a platform, a probe card with a probe, and an inspection module that determines positions using cameras and motor systems to automatically align and adjust the probe card, including temperature control to maintain precise alignment during probing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual adjustment methods are used to align the probe card, then ease of operation is improved, but measurement precision deteriorates due to temperature changes affecting alignment
Solution Approach 1:
The patent replaces manual mechanical adjustment with an automated positioning system that uses cameras to detect probe and DUT positions, motor systems to execute precise movements, and computer control to coordinate the entire alignment process. This substitution eliminates human intervention while maintaining high precision through digital control and feedback mechanisms.
Solution Approach 2:
The system performs self-alignment by automatically detecting the positions of the probe and device under test using cameras, calculating required adjustments, and executing positioning without external manual intervention. The automated system serves itself by integrating sensing, computation, and actuation within the same system.
2Measurement precision
If temperature control is implemented to maintain alignment precision, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The system performs preliminary position detection and alignment before the actual probing operation. By pre-aligning the probe card to the device under test using camera-based detection and motor-driven positioning, the system ensures precise alignment is established in advance, reducing the need for complex real-time temperature compensation during probing.
Solution Approach 2:
The patent implements feedback mechanisms where cameras continuously monitor the positions of the probe and DUT, and the computer system adjusts the motor-driven positioning based on detected deviations. This closed-loop feedback system maintains alignment precision by compensating for thermal effects through active adjustment rather than requiring complex passive compensation designs.
3Measurement precision
If automated alignment system is implemented, then measurement precision is improved, but ease of operation deteriorates
Solution Approach 1:
The automated alignment system performs self-service by automatically detecting component positions, calculating alignment requirements, and executing positioning adjustments without requiring operator intervention. The system monitors and adjusts alignment autonomously, eliminating the need for manual skills while maintaining high precision.
Solution Approach 2:
The patent replaces manual mechanical alignment operations with an automated system that uses optical detection (cameras), computational processing (computer), and motorized actuation to achieve precise positioning. This substitution eliminates the need for skilled manual adjustment while delivering consistent high-precision results.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures accurate and automatic alignment of the probe card with the device under test, maintaining alignment precision even after temperature adjustments, thereby enhancing the reliability of semiconductor testing.
Implementation Method 1
an inspection module configured to determine positions of the probe and the device under test... The inspection module includes a first camera disposed above the device under test and configured to optically inspect the device under test, and a second camera disposed under the probe and configured to optically inspect the probe
Implementation Method 2
adjusting a temperature of the probe to a predetermined temperature by the temperature-controlling device
Data Source
AI summary
A method of operating a probing apparatus is disclosed. The method includes providing a chuck configured to support a DUT, a probe card disposed above the DUT and having a probe, and an inspection module configured to determine positions of the DUT and the probe. The method further includes determining a first position of a DUT by an inspection module; moving a probe card to align a first position of a probe with the first position of the DUT; moving a chuck toward the probe; adjusting a temperature of the probe to a predetermined temperature by a temperature-controlling device; determining a second position of the probe by the inspection module after the adjustment of the temperature of the probe; moving the probe card to align the probe with the position of the DUT based on the determination of the second position of the probe; and probing the DUT.