Probe Card Thermal Management for Rapid Preheating
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Solution Overview
Problem
Semiconductor probe cards require significant time to heat up or cool down, leading to downtime in testing equipment and inefficiencies due to their large mass and the need for preheat times, which can be costly and reduce equipment availability.
Innovation Solution
A probe card with a thermal management apparatus that includes a temperature control device and sensor, allowing for external power sourcing to rapidly condition the card to desired temperatures before testing, reducing downtime by facilitating thermal conditioning outside the testing environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the probe card is heated or cooled using conventional methods, then the probe card reaches the desired temperature, but the process takes a long time due to the large mass of the probe card
Solution Approach 1:
The patent applies preliminary action by heating the probe card to the desired temperature before the actual testing process begins. The probe card includes heating elements that can pre-heat the card to match the device under test temperature, eliminating the need for time-consuming heating during testing operations.
Solution Approach 2:
The patent implements local quality by placing heating elements at specific locations on the probe card where thermal conditioning is most needed. This localized heating approach is more efficient than heating the entire large-mass probe card uniformly, reducing the time required to reach target temperatures.
2Stability of the object's composition
If the probe card mass is increased to ensure structural stability and alignment, then the probe card rigidity is improved, but the thermal response time is significantly increased
Solution Approach 1:
The patent applies segmentation by dividing the probe card into multiple sections with independent thermal control. Heating elements are distributed across different segments of the probe card, allowing selective and efficient heating of specific areas rather than heating the entire large-mass structure, thus improving thermal response time while maintaining overall structural stability.
3Device complexity
If the probe card is thermally conditioned within the tester, then the temperature control is integrated, but the tester downtime is increased
Solution Approach 1:
The patent enables preliminary thermal conditioning of the probe card to be performed outside the tester environment. The probe card can be pre-heated to the required temperature before insertion into the tester, allowing the tester to be immediately productive without waiting for thermal equilibration, thus improving tester availability while maintaining integrated temperature control capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables more accurate and efficient testing by allowing probe cards to be assembled and tested at operating temperatures, reducing downtime and improving equipment availability by conditioning the probe cards externally, thus enhancing the thermal management of the probe cards.
Implementation Method 1
a thermal management apparatus disposed on the probe card to heat and/or cool the probe card
Implementation Method 2
a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card
Data Source
AI summary
Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card; a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and a second connector, different than the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester.