Inspection Probe Carrier Warpage and Current Backflow
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Solution Overview
Problem
The existing inspecting devices for semiconductor packages face issues with reduced backflow path of currents due to screws used to reduce warpage, leading to decreased current backflow ratio and adverse effects on power and signal integrity during inspections.
Innovation Solution
An inspecting device with a carrier, telescopic probes, a locking component, and a conductive structure, where the conductive structure is partially embedded in the locking component and electrically connected to the ground pad, allowing improved current backflow while reducing warpage, and incorporating screws with different pitch densities to minimize device shaking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If screws are disposed on the carrier to reduce warpage, then the warpage of the carrier is reduced, but the backflow path of currents is reduced and the current backflow ratio is decreased
Solution Approach 1:
The locking component is segmented into multiple functional parts: a screw portion for mechanical warpage control and a conductive structure portion for current backflow. This segmentation allows the single locking component to simultaneously address both warpage reduction and current backflow path provision, resolving the contradiction between mechanical stability and electrical reliability.
Solution Approach 2:
The locking component is designed as a multi-functional element that combines both mechanical locking (screw threads engaging with the carrier and probe holder) and electrical conduction (conductive structure providing current backflow path). This multi-functionality eliminates the need for separate components and resolves the contradiction by making one component serve both purposes.
2Ease of operation
If telescopic probes are pressed to inspect semiconductor packages, then inspection is performed, but reaction force causes warpage of the carrier
Solution Approach 1:
The locking component acts as an intermediary mechanical element between the probe holder and the carrier. It provides a secure locking mechanism that distributes and anchors the reaction forces from probe pressing, preventing these forces from causing carrier warpage while still allowing the telescopic probes to function for inspection.
3Stability of the object's composition
If screws take part of the space of telescopic probes, then warpage is reduced, but the backflow path of currents is reduced
Solution Approach 1:
The locking component is segmented into a screw portion for mechanical warpage control and a conductive structure portion for current backflow. This segmentation allows the single locking component to simultaneously address both warpage reduction and current backflow path provision, resolving the contradiction between mechanical stability and electrical reliability.
Solution Approach 2:
The conductive structure extends in a direction from the screw head toward the ground pad, creating a three-dimensional current backflow path that utilizes the vertical and lateral space within the locking component. This dimensional approach maximizes the backflow path area within the constrained space of the locking component, resolving the contradiction between space occupation and backflow path provision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the backflow path of currents, increases the current backflow ratio, and improves power and signal integrity performance, while reducing the likelihood of device shaking during inspections.
Implementation Method 1
the conductive structure, the locking component, and the ground pad are electrically connected
Data Source
AI summary
An inspecting device including a carrier, multiple telescopic probes, a locking component and a conductive structure is provided. The carrier has a through hole and a ground pad corresponding to the through hole. The through hole penetrates from the first surface to the second surface of the carrier, and the ground pad is disposed on the second surface. The telescopic probes are disposed in parallel on the first surface of the carrier. The locking component passes through the through hole and is disposed between two adjacent telescopic probes of the multiple telescopic probes. The locking component includes a screw. A head of the screw has a first pitch and a second pitch, and a density of the first pitch is different from a density of the second pitch. The conductive structure is partially embedded in the locking component, and the conductive structure, the locking component and the ground pad are electrically connected.