Probe Connector for Thermal Mounting Hole Debugging
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Solution Overview
Problem
Conventional circuit boards face challenges in compact design and debugging due to the need for surface mounted debug connectors, which consume routing space and surface area, and are costly and complex, limiting debug support for CPUs and PCHs.
Innovation Solution
A probe connector system utilizing a probing pad structure around thermal attach mounting holes, minimizing routing area and surface area usage, allowing for compact design and scalable, cost-effective debugging without the need for surface mounted connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If surface mounted debug connectors are used for CPU and PCH debugging, then debug support is provided, but routing space and surface area are consumed, increasing design complexity and cost
Solution Approach 1:
The patent extracts the debugging functionality from traditional surface mounted connectors and relocates it to the processor package itself. Debug probes are integrated directly into the processor package, allowing debugging signals to be accessed through the existing package substrate without requiring separate surface mounted connector components, thereby eliminating the need for additional routing space and surface area on the circuit board.
Solution Approach 2:
The patent merges the debugging functionality with the processor package structure. The debug probes are integrated within the processor package substrate, combining the processor housing and debugging interface into a single integrated unit. This merging eliminates the need for separate surface mounted debug connectors and reduces routing complexity by utilizing the existing package substrate for signal transmission.
2Adaptability or versatility
If surface mounted debug connectors are used, then debugging capability is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the debugging capability from complex surface mounted connectors and relocates it to the processor package. By integrating debug probes directly into the package substrate, the design eliminates the need for separate, complex connector assemblies, reducing overall device complexity while maintaining full debugging functionality.
Solution Approach 2:
The processor package substrate serves multiple functions: it houses the processor core, provides thermal management pathways, and integrates debugging probes. This multi-functionality eliminates the need for dedicated debug connector components, simplifying the overall device architecture while providing comprehensive debugging capability across multiple signal types.
3Area of stationary object
If thermal attach mounting holes are utilized for probe connector engagement, then compact design is achieved with minimized routing area, but the mounting hole structure must support both thermal and mechanical functions
Solution Approach 1:
The mounting hole structure serves dual purposes: it provides thermal attachment pathways for heat dissipation and simultaneously serves as the mechanical engagement point for probe connector assembly. By making the mounting hole multi-functional, the design eliminates the need for separate thermal vias and mechanical mounting features, reducing overall routing area while maintaining both thermal and structural integrity.
Solution Approach 2:
The patent merges thermal management and mechanical mounting functions into a single integrated structure. The mounting hole is designed to accommodate both thermal attachment materials and probe connector engagement, combining what would traditionally be separate functional elements into one unified feature, thereby minimizing routing area and simplifying the overall design.
Data Source
AI summary
A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.