Probe Core Twist Lock Mechanism for Semiconductor Testing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in effectively testing semiconductor devices for low currents and evaluating device characteristics over a wide temperature range due to issues like external electrical interference, leakage currents, and parasitic capacitance, which existing test equipment struggles to address.
Innovation Solution
A probe core apparatus with a twist lock mechanism is developed, featuring a frame, wire guide, probe tiles, and probe wires with signal and guard portions, allowing for secure connection and disconnection to a circuit board, enabling precise electrical probing and signal transmission while minimizing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a probe core is designed for secure connection and disconnection to circuit board, then reliability of electrical probing is improved, but device complexity increases due to lock mechanism
Solution Approach 1:
The probe core is divided into modular components including a frame, wire guide, probe tiles, and lock mechanism. This segmentation allows each component to perform its specific function independently while maintaining overall system reliability without excessive complexity.
Solution Approach 2:
The lock mechanism enables dynamic connection and disconnection of the probe core to the circuit board. The rotatable lock allows the probe core to transition between locked and unlocked states, providing secure connection when needed while allowing easy removal when required.
2Measurement precision
If probe wires include guard portions to minimize electrical interference, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The probe wires are designed with different portions having different functions: signal transmitting portions for carrying measurement signals and guard portions for minimizing electrical interference. This local differentiation of wire properties allows precise current measurement while keeping the overall wire structure manageable.
Solution Approach 2:
The guard portions act as intermediary elements between the signal transmitting portions and the external environment. They shield the signal wires from electrical interference, leakage currents, and parasitic capacitance, thereby improving measurement precision without requiring complete redesign of the wire structure.
3Adaptability or versatility
If probe core is designed for wide temperature range testing, then adaptability is improved, but reliability deteriorates due to dielectric material characteristics
Solution Approach 1:
The probe core is designed to operate across a wide temperature range by selecting materials and designing structures that maintain their electrical characteristics under varying thermal conditions. The frame, wire guide, and probe tiles are configured to accommodate thermal expansion and contraction while maintaining reliable electrical connections.
Data Source
AI summary
A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.