Ultrasound Probe Coverlay FPC Breakage Prevention
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Solution Overview
Problem
The existing ultrasound probes face challenges in manufacturing due to the risk of breakage of the flexible printed circuit (FPC) wiring patterns, particularly when folding the FPC after the adhesive has set, which can lead to disconnection and affect the reliability of the connection between the piezoelectric transducer and the backing material.
Innovation Solution
A coverlay, such as a polyimide film, is used to protect the wiring pattern of the flexible substrate, which is folded in a direction opposite to the radiation direction around the end of the backing material, ensuring that the coverlay covers the folded section and extends into a space created between the layers, thereby preventing breakage during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the FPC is folded toward the subsequent circuit side at the end of the front face of the backing material, then the ultrasound probe size is reduced and impact resistance is improved, but the wiring pattern of the FPC is at risk of breakage due to folding
Solution Approach 1:
A coverlay is provided on the folded section of the FPC before the folding process is completed. This coverlay acts as a protective cushion that prevents the wiring pattern from breaking during folding and subsequent handling, thereby maintaining reliability while achieving compact probe size
Solution Approach 2:
The coverlay is applied to the FPC wiring pattern before the FPC is folded toward the subsequent circuit side. This preliminary protective action ensures that the wiring pattern is already protected when the folding stress is applied, preventing breakage while maintaining the compact configuration
2Reliability
If the FPC and intermediate layer are adhered using adhesive to improve connection reliability, then the connection between FPC and piezoelectric transducer is improved, but the wiring pattern is at risk of breakage when folding the FPC after adhesive sets
Solution Approach 1:
The coverlay is applied to protect the wiring pattern before the FPC is folded, even after the adhesive has set. This beforehand cushioning prevents the adhesive-bonded wiring pattern from breaking during the folding process, maintaining both connection reliability and wiring integrity
Solution Approach 2:
The coverlay acts as an intermediary protective layer between the adhesive-bonded FPC wiring pattern and the mechanical stress of folding. This intermediary protects the vulnerable wiring pattern while allowing the adhesive to maintain its bonding function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents breakage of the wiring pattern and ensures reliable connection between the intermediate layer and the backing material, enhancing the structural integrity and acoustic characteristics of the ultrasound probe without increasing the width of the probe, thus maintaining efficient ultrasound imaging.
Implementation Method 1
the ultrasound imaging apparatus sends a control signal regarding the scanning of the ultrasound waves to the ultrasound probe. Based on the control signal, ultrasound waves are sent to the subject through the ultrasound probe
Implementation Method 2
an acoustic matching layer is placed with an electrode in between. The acoustic matching layer is placed for the purpose of matching the acoustic impedance of the piezoelectric transducer and the acoustic impedance of a biological object
Implementation Method 3
The ultrasound waves irradiated to the back face side of the piezoelectric transducer are attenuated and absorbed by the backing material
Implementation Method 4
The intermediate layer has higher acoustic impedance than the piezoelectric transducer, and is provided to enhance the radiation efficiency of the ultrasound waves. Due to the gap between the acoustic impedance of the intermediate layer and the acoustic impedance of the piezoelectric transducer, the ultrasound waves irradiated to the back face side of the piezoelectric transducer are reflected by these interfaces
Data Source
AI summary
A backing material is provided on the back face side of a piezoelectric transducer, with a first width substantially equal to the piezoelectric transducer widthwise and perpendicular to the radiation direction. A front face of a layer located on the front face side with regard to a wiring pattern has a width substantially equal to the first width. Moreover, the back face of this layer has a second width shorter than the first width. A space is provided between this layer and the backing material due to the difference between the first width and the second width of this layer, and a covering member covering the wiring pattern covers the wiring pattern extending at least from the folded section of the flexible substrate into the space.