Probe Device Vertical Contact Path for Low Inductance
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Solution Overview
Problem
Conventional probe devices for semiconductor wafer electrical testing face challenges in reducing electrical resistance and inductance due to longer electrical paths, which affect the accuracy of high-frequency signal measurements and the quality of power devices.
Innovation Solution
The probe device incorporates a contact probe with a gold-plated and intermediate plated layer, formed from a single metal material, featuring a contact portion and cable connection portion that are vertically movable, reducing the electrical path and integrating these components with a biasing member to minimize resistance and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrical path in the probe device is lengthened to connect the conductive film electrode and tester, then the device can perform electrical testing, but the resistance and inductance increase leading to measurement inaccuracies
Solution Approach 1:
The contact probe extends the electrical connection in a vertical dimension from the side surface of the mounting table to the electrode plate, rather than using a long horizontal cable connection. This spatial reconfiguration significantly reduces the electrical path length while maintaining testing capability
Solution Approach 2:
The contact probe acts as an intermediary component that bridges the conductive film electrode on the mounting table and the electrode plate above it, providing a direct electrical connection that eliminates the need for long cables and reduces resistance and inductance
2Reliability
If pogo pins and annular electrode plate are used to electrically connect the conductive film electrode, then the electrical connection is established, but the electrical path becomes longer increasing resistance and inductance
Solution Approach 1:
The contact probe provides a vertical electrical connection path from the side surface upward to the electrode plate, replacing the conventional horizontal cable routing. This dimensional change minimizes the electrical path length and associated energy losses
3Reliability
If a long cable is used to connect the conductive film electrode and tester, then electrical connection is achieved, but the inductance increases causing waveform distortion at high frequencies
Solution Approach 1:
The contact probe creates a compact vertical electrical path that replaces extended horizontal cable routing, significantly reducing inductance and preventing waveform distortion during high-frequency measurements
Solution Approach 2:
The flexible cable connection is replaced with a rigid contact probe structure that provides a stable, low-inductance electrical path, eliminating the mechanical flexibility but gaining electrical performance for high-frequency applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces electrical resistance and inductance, enabling precise high-frequency signal measurements and improving the accuracy of semiconductor device testing by shortening the electrical path and enhancing the connection between the semiconductor wafer and the tester.
Implementation Method 1
a gold-plated layer and an intermediate plated layer are formed on a surface of the contact probe
Implementation Method 2
the contact portion and the cable connection portion are configured to be vertically movable by a biasing member provided below the cable connection portion
Implementation Method 3
a cable electrically connected to the mounting table electrode being connected to the cable connection portion
Data Source
AI summary
A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.