Probe Apparatus Elastic Retainer for Non-Contact Coupling Gap

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Solution Overview

Problem

Conventional probe cards face challenges in achieving optimal non-contact coupling with semiconductor wafers due to the difficulty in matching the height of non-contact and contact coupling terminals, leading to a gap between the non-contact coupling terminal and the wafer, which cannot be adjusted.

Innovation Solution

A probe apparatus with a retaining section that allows the relative position between the contact and non-contact sections to be displaced, utilizing a thin film section with elasticity and conductive rubber to adjust the distance between the non-contact section and the semiconductor wafer, enabling precise positioning for effective signal exchange.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If contact coupling terminals are made longer to achieve proper contact coupling, then contact coupling reliability is improved, but a gap is created between non-contact coupling terminals and the semiconductor wafer, worsening non-contact coupling efficiency

Engineering Contradiction:
Improvecontact coupling reliabilityVSAvoidnon-contact coupling efficiency
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The retaining section is designed with elastic deformation capability, allowing the non-contact coupling terminal to dynamically adjust its position. When the probe card contacts the semiconductor wafer, the retaining section elastically deforms to bring the non-contact coupling terminal closer to the wafer surface, optimizing the gap distance for efficient magnetic field coupling while maintaining reliable contact coupling through the longer contact terminals.

Inventive Principle:
Principle #15Dynamics

2Loss of energy

If non-contact coupling terminals are made shorter to reduce the gap with the semiconductor wafer, then non-contact coupling efficiency is improved, but contact coupling reliability deteriorates due to insufficient length

Engineering Contradiction:
Improvenon-contact coupling efficiencyVSAvoidcontact coupling reliability
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The probe card is segmented into functionally independent components: contact coupling terminals for electrical contact, non-contact coupling terminals for magnetic field coupling, and a retaining section that selectively positions each type. This segmentation allows each terminal type to be optimized for its specific function without compromising the other, as the retaining section manages the spatial relationship between them.

Inventive Principle:
Principle #1Segmentation

3Manufacturing precision

If non-contact coupling terminals are fixed rigidly to the substrate, then manufacturing precision is improved, but the ability to adjust the distance to the semiconductor wafer is lost, worsening coupling efficiency

Engineering Contradiction:
Improveterminal positioning precisionVSAvoidnon-contact coupling efficiency
Core Design Contradiction:
Manufacturing precisionVSLoss of energy

Solution Approach 1:

The retaining section's elastic modulus and geometric parameters are carefully selected to provide appropriate flexibility. The section undergoes controlled elastic deformation under contact load, changing the position parameter of the non-contact coupling terminal to optimize the gap distance with the semiconductor wafer surface, thereby achieving efficient coupling while maintaining manufacturing precision in the overall structure.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for improved connection reliability and adjustment of the distance between the non-contact section and the semiconductor wafer, enhancing the signal exchange efficiency and reliability of both contact and non-contact coupling.

Implementation Method 1

utilizing a thin film section with elasticity and conductive rubber to adjust the distance between the non-contact section and the semiconductor wafer

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

exchanging signals with a target device by non-contact coupling by means of magnetic field coupling and electric field coupling

Methodology Applied
Scientific EffectMagnetic field coupling: Magnetic Field

Implementation Method 3

exchanging signals with a target device by non-contact coupling by means of magnetic field coupling and electric field coupling

Methodology Applied
Scientific EffectElectric field coupling: Electric Field

Data Source

PatentUS8253428B2Probe apparatus and test apparatus
Publication Date: 2012.08.28 ADVANTEST CORP
  • US8253428B2 patent drawing
  • US8253428B2 patent drawing
  • US8253428B2 patent drawing

AI summary

A probe apparatus exchanging signals with a target device, includes: a contact section electrically connected to the target device by contacting a terminal of the target device; a non-contact section that exchanges signals with the target device in a state not contacting the terminal of the target device; and a retaining section that retains the contact section and the non-contact section, in such a manner that a relative position between the contact section and the non-contact section in a connection direction connecting the non-contact section and a region corresponding to the target device is displaceable.