3D-Printed Probe-Fed Patch Antenna for Rapid Frequency Tuning
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Solution Overview
Problem
Existing patch antenna structures face challenges in design and manufacturing, particularly in tuning parameters and scalability with frequency and bandwidth, due to the limitations of traditional PCB materials.
Innovation Solution
The use of additive manufacturing processes, such as 3D printing, to create antenna structures with a probe-fed radiating patch above a ground plane, separated by a dielectric foam material, allowing for easy modification and tuning of antenna parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional PCB materials and manufacturing processes are used for patch antennas, then manufacturing precision and structural integrity are maintained, but design flexibility and parameter tuning capability are limited
Solution Approach 1:
The patent applies parameter changes by transitioning from traditional PCB materials to additive manufacturing processes, enabling continuous adjustment of geometric parameters (patch dimensions, feed position, substrate thickness) and material properties (dielectric constant, loss tangent) to optimize antenna performance for different frequency bands and applications
Solution Approach 2:
The patent utilizes composite materials by combining conductive materials (copper, aluminum, or conductive polymers) with dielectric materials (foam substrates, plastics, or ceramics) in the additive manufacturing process, creating multi-material antenna structures that achieve desired electrical and mechanical properties
2Adaptability or versatility
If PCB redesign is performed to adjust antenna parameters, then frequency scalability is achieved, but time and cost increase significantly
Solution Approach 1:
The patent applies dynamics by implementing parametric modeling in the additive manufacturing process, where antenna geometry parameters can be dynamically adjusted through software control without physical redesign, enabling rapid frequency scaling and optimization iterations
Solution Approach 2:
The patent enables frequency scalability through parameter changes by allowing continuous modification of antenna dimensions, feed locations, and substrate properties in the digital model before manufacturing, eliminating the need for time-consuming PCB redesign cycles
3Shape
If conventional manufacturing methods are used, then structural integrity is ensured, but geometric flexibility and complex shape capability are reduced
Solution Approach 1:
The patent applies local quality by enabling different regions of the antenna structure to have different material properties and geometric characteristics through additive manufacturing, such as varying wall thicknesses, incorporating internal voids, or applying selective surface finishing to optimize both shape flexibility and dimensional accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables flexible frequency scalability and reduces the time and cost associated with redesigning PCBs, while maintaining effective microwave signal radiation through fringing fields.
Implementation Method 1
a dielectric material between the ground plane and the patch
Implementation Method 2
The radiation mechanism arises from fringing fields along the radiating edges
Data Source
AI summary
A method of manufacturing an antenna assembly includes additively manufacturing an element that is monolithic and that includes (i) a ground plane, (ii) a patch above the ground plane, and (iii) a structure having a lower end in contact with the ground plane and an upper end in contact with the patch. The method further includes applying a dielectric material between the ground plane and the patch. In an example, the dielectric material is dielectric foam. The method further includes removing a section of the ground plane around the lower end of the structure, such that the structure extends through the ground plane and not in contact with the ground plane. The method further includes connecting an inner conductor of a coaxial cable connector to the lower end of the structure, and an outer portion of the coaxial cable connector to the ground plane.