Probe Substrate Flange Bonding for High-Temperature Probe Cards
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Solution Overview
Problem
Existing electrical connecting apparatuses, such as probe cards, face durability issues under high-temperature environments due to inadequate adhesion between ceramics and metals, leading to potential peeling and cracking.
Innovation Solution
An electrical connecting apparatus that includes a wiring substrate electrically connected to a wiring substrate substrate substrate substrate and a probe substrate, where an annular flange is bonded to the edge of the probe substrate using a high-temperature-compatible bonding material without the need for fixing tools, enhancing adhesion and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If general-purpose adhesive is used to bond the ring flange to the ceramic substrate, then the assembly process is simple, but the adhesion fails under high-temperature environments (150°C or higher)
Solution Approach 1:
The patent changes the chemical composition parameters of the bonding material from general-purpose adhesive to a specifically formulated high-temperature-resistant bonding material. This material contains inorganic fillers and resin components designed to maintain adhesion properties at temperatures of 150°C or higher, directly resolving the contradiction between assembly simplicity and adhesion durability under high-temperature conditions.
Solution Approach 2:
The bonding material is formulated as a composite material containing inorganic fillers (such as alumina or silica) dispersed in a high-temperature-resistant resin matrix. This composite structure provides both the ease of application like conventional adhesives and the thermal stability required for high-temperature environments, simultaneously addressing both requirements of the contradiction.
2Ease of manufacture
If general-purpose adhesive is used under high-temperature environment, then the bonding process is straightforward, but cracks occur in the ceramic due to differential thermal expansion
Solution Approach 1:
The bonding material's thermal and mechanical parameters are specifically adjusted to match those of the ceramic substrate. The material's linear expansion coefficient is designed to be close to that of ceramics, and its modulus of elasticity is optimized to provide flexibility under thermal stress. This parameter optimization allows the bonding process to remain simple while eliminating crack formation due to differential thermal expansion at temperatures of 150°C or higher.
3Strength
If fixing tools (bolts, screws) are used to attach the ring flange, then the mechanical strength is sufficient, but the assembly process becomes complex and time-consuming
Solution Approach 1:
The patent replaces the mechanical fastening system (bolts, screws, and threaded holes) with a chemical bonding system using high-temperature-resistant bonding material. This substitution eliminates the need for fixing tools and their associated assembly steps while maintaining or exceeding the mechanical strength requirements. The bonding material creates a unified structure that is inherently stronger than mechanical fasteners and simplifies the assembly process significantly.
Solution Approach 2:
The ring flange and ceramic substrate are merged into a single integrated structure through direct bonding with the bonding material, eliminating the separate components and fasteners required in mechanical attachment. This merging reduces the number of parts and assembly steps, decreasing device complexity while maintaining structural integrity and mechanical strength under high-temperature conditions.
4Ease of manufacture
If conventional adhesive bonding method is used, then the initial assembly is easy, but the bonded surface peels off under high-temperature conditions
Solution Approach 1:
The bonding material's chemical composition is specifically modified to resist thermal degradation. It incorporates inorganic fillers and high-temperature-resistant resin systems that maintain their bonding properties at 150°C or higher, preventing the peeling that occurs with conventional adhesives. This parameter change preserves the ease of initial assembly while dramatically extending the service life and durability of the bonded surface under high-temperature operating conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves adhesion and bonding strength between ceramics and metals even under high-temperature conditions, reducing the risk of peeling and cracking, and increases productivity by eliminating the need for fixing tools.
Implementation Method 1
an annular flange for connecting the probe substrate to the connection unit is bonded to an edge portion of the probe substrate with a bonding material
Data Source
AI summary
To provide an electrical connecting apparatus capable of improving adhesion between ceramics and metal and of bonding strongly therebetween, even under high-temperature environments. The present disclosure provides an electrical connecting apparatus configured to electrically contact a probe with each of a plurality of electrode terminals of a device under test to electrically connect a test apparatus and the device under test, the electrical connecting apparatus including: a wiring substrate electrically connected to the test apparatus; a probe substrate including the plurality of probes; and a connection unit configured to electrically connect the wiring substrate to each of the plurality of probes of the probe substrate, wherein an annular flange for connecting the probe substrate to the connection unit is bonded to an edge portion of the probe substrate with a bonding material without using a fixing tool.