Probe Apparatus Gas Atmosphere Spark Suppression
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Solution Overview
Problem
During the inspection of electrical characteristics of semiconductor devices at wafer level, high voltage applications can lead to spark generation near the wafer surface, potentially damaging adjacent chips, especially in SiC power devices with narrow electrode gaps, and existing solutions involving insulating liquids complicate device configuration and prolong inspection time.
Innovation Solution
A probe apparatus that forms a gas atmosphere with pressure higher than atmospheric pressure around the probe needles using a gas supply device, suppressing spark occurrence by applying Paschen's law, with a surrounding member and contact plate configuration to simplify the setup and maintain efficient inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high voltage is applied to inspect power devices, then inspection capability is improved, but spark generation occurs near wafer surface damaging adjacent chips
Solution Approach 1:
The patent applies the principle of creating an inert atmosphere by filling the inspection chamber with insulating gas (such as nitrogen or sulfur hexafluoride) to replace the ordinary atmosphere. This inert gas environment prevents spark generation between probe needles and adjacent chips during high-voltage inspection of power devices, while maintaining the ability to perform reliable electrical characteristic measurements.
2Object-affected harmful factors
If insulating liquid is used to cover wafer surface, then spark suppression is improved, but device complexity and inspection time increase
Solution Approach 1:
The patent replaces the liquid-based spark suppression method with a gas-based pneumatic system. Insulating gas is supplied into the inspection chamber through gas supply ports, creating a spark-free environment without requiring liquid handling mechanisms, pumps, or complex drainage systems. This pneumatic approach significantly simplifies the device structure while maintaining effective spark suppression.
Solution Approach 2:
The patent extracts the essential function of spark suppression from the complex liquid handling system and implements it through a simplified gas supply system. By taking out only the necessary spark suppression capability and realizing it through gas atmosphere control, the patent eliminates unnecessary complexity associated with liquid coverage mechanisms.
3Object-affected harmful factors
If insulating liquid is used to cover wafer surface, then spark suppression is improved, but inspection time is prolonged
Solution Approach 1:
The patent uses a gas supply system that can rapidly fill the inspection chamber with insulating gas, enabling quick establishment of the spark-suppressing environment. The gas can be supplied and pressurized much faster than liquid can be pumped and distributed across the wafer surface, significantly reducing the time required to prepare for high-voltage inspection while maintaining effective spark suppression throughout the inspection process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents sparks near the wafer surface during high-voltage inspections, ensuring safe and efficient testing of semiconductor devices without increasing inspection time or complexity, particularly effective for SiC power devices.
Implementation Method 1
suppressing spark occurrence by applying Paschen's law
Data Source
AI summary
A probe apparatus can suppress a spark from occurring near a wafer surface simply and efficiently when inspecting electrical characteristics of a semiconductor device at wafer level. A spark preventing device 50 mounted in the probe apparatus includes a surrounding member 52 which surrounds probe needles 24G and 24S between a probe card 16 and a mounting table 12; and a gas supply device 54 configured to supply a gas to a vicinity of the probe needles 24G and 24S through an inside or a vicinity of the surrounding member 52 to form an atmosphere of a preset pressure higher than an atmospheric pressure in the vicinity of the probe needles 24G and 24S when inspecting the electrical characteristics of each chip on a semiconductor wafer W. A contact plate 34 also serves as the surrounding member 52.