Probe Head Liquid-Cooled Heat Exchanger for High-Power Testing
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Solution Overview
Problem
Existing probe heads struggle to manage significant heat dissipation from high-power devices under test, leading to overheating issues that prior solutions fail to adequately address.
Innovation Solution
Integration of liquid-cooled heat exchangers at strategic locations on the probe card, with heat conduction features passing vertically through the printed circuit board, and controlled by an external chiller to manage thermal flux and temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-power devices under test are used, then testing capability is improved, but heat dissipation becomes excessive causing probe head overheating
Solution Approach 1:
The patent extracts the heat dissipation function from the probe head structure by integrating a liquid-cooled heat exchanger that removes heat from the probe head. The heat exchanger includes channels or cavities through which coolant flows, actively carrying heat away from the probe head to prevent overheating while maintaining high power testing capability
Solution Approach 2:
The patent introduces coolant as an intermediary substance that mediates heat transfer between the probe head and the external environment. The coolant absorbs heat from the probe head through thermal conduction in the heat exchanger channels and transports it away, enabling the probe head to handle high power without overheating
2Temperature
If heat exchanger is integrated into probe head, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat exchanger functionality with existing probe head components such as the printed circuit board, guide plates, or spacer. By integrating thermal management features into structural components that already exist in the probe head, the design achieves effective cooling without proportionally increasing overall device complexity
Solution Approach 2:
The patent makes existing probe head components multi-functional by enabling them to serve both structural support roles and thermal management roles. For example, the printed circuit board or guide plates are designed with integrated heat exchanger channels, allowing these components to simultaneously provide mechanical support and active cooling functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents overheating of the device under test and probe card by actively managing heat flux and reducing thermal resistance, ensuring efficient heat dissipation.
Implementation Method 1
heat conduction features (e.g., solid heat conduction members or liquid flow pipe sections) that pass vertically through the printed circuit board
Implementation Method 2
liquid-cooled heat exchanger element with liquid flow inlets and liquid flow outlets in liquid communication with the heat exchanger element
Implementation Method 3
Probes can function as thermal path for transferring heat to heat exchanger
Data Source
AI summary
Improved heat dissipation in probe heads for testing electrical devices is provided by the use of liquid cooled heat exchanger elements combined with heat conduction features that pass vertically through the printed circuit board of the probe head. In cases where the heat exchanger element(s) are disposed on the DUT-side of the probe head, the heat conduction features are pipes for liquid flow to and from the heat exchanger element(s). In cases where the heat exchanger element(s) are disposed on the top side of the probe head (e.g., on the stiffener), the heat conduction features are solid thermal conduction members configured to increase thermal conduction from the DUT side of the probe head to the top side. The heat exchanger elements can be separate parts, or they can be integrated with probe head components such as the stiffener or the mounting ring.