Probe Head Metal Pin Block Reducing Ground Inductance
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Solution Overview
Problem
Conventional probe heads with resin pin blocks exhibit high inductance values, leading to poor signal transmission characteristics in electrical inspections of ICs.
Innovation Solution
A probe head design featuring a metal pin block electrically connected to a first ground probe and insulated from a signal probe, with an additional insulation layer on the device side, and a second ground probe with a larger diameter and shorter length to reduce inductance and improve signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the pin block is made of resin, then the manufacturing is easier and cost is lower, but the inductance value of the ground probe is high and signal transmission characteristics are poor
Solution Approach 1:
The pin block material is changed from resin to metal, fundamentally altering the electrical parameters (inductance) while maintaining manufacturing feasibility through standard metal processing techniques
Solution Approach 2:
The pin block is designed as a composite structure with metal providing electrical conductivity and resin providing insulation, combining the advantages of both materials to achieve low inductance while maintaining ease of manufacture
2Reliability
If the pin block is made of metal, then the inductance value is reduced and signal transmission is improved, but the manufacturing complexity increases
Solution Approach 1:
The pin block is designed as a composite structure with metal providing electrical conductivity and resin providing insulation, combining the advantages of both materials to achieve low inductance while maintaining ease of manufacture
Solution Approach 2:
Different portions of the pin block have different material properties - the portion contacting the ground probe is metal for conductivity, while the portion contacting the signal probe is resin for insulation, allowing optimized performance without overall complexity increase
3Reliability
If the insulation layer is added on the pin block surface, then the electrical insulation is improved, but the device complexity increases
Solution Approach 1:
A thin film insulation layer is applied to the pin block surface, providing effective electrical insulation with minimal added complexity and volume
Solution Approach 2:
The insulation layer acts as an intermediary between the metal pin block and the signal probe, preventing electrical contact while allowing mechanical integration, thus simplifying the overall structure
Data Source
AI summary
Provided is a probe head capable of reducing an inductance value of a ground probe. In a probe head 1, a pin plate 40, a pin block 50, and a solder resist film 60 are stacked in this order from a measuring instrument side to be integrally formed, and constitute a support body that supports a signal probe 10 and a first ground probe 20. The pin plate 40 is an insulator. The pin block 50 is a conductor, and is electrically connected to the first ground probe 20 and a measuring instrument-side ground, and is not electrically connected to the signal probe 10. The solder resist film 60 is provided on the surface of the pin block 50 on a side of a device to be inspected, and is interposed between the pin block 50 and the device to be inspected.