Probe Head Assembly Using Raising Jig for Fine-Pitch Alignment

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Solution Overview

Problem

The assembly of probe heads with small pitch probe pins is challenging due to the fragility of thin pins and difficulties in drilling holes in guide plates, leading to low manufacturing yield and damage to materials.

Innovation Solution

The use of a probe head structure where upper and lower guide plates are aligned with vertically corresponding through-holes, and probe pins are inserted with stoppers that prevent damage, followed by spacing using raising jigs, spacers with bevels, or counter-rotating spacers to maintain alignment and distance, facilitating assembly without increasing complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If manual handling is used for inserting probe pins into guide plates, then flexibility in assembly is maintained, but probe pins are prone to damage due to their thin diameters (1-4 mils)

Engineering Contradiction:
ImproveManual handling flexibilityVSAvoidProbe pin damage resistance
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

A raising jig is introduced as an intermediary tool to hold and position the upper guide plate during assembly. The jig provides controlled support and alignment, eliminating direct manual handling of fragile probe pins while maintaining assembly flexibility. The jig can be easily removed after positioning, leaving the final assembly unchanged.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If drilling holes in upper and lower guide plates is performed conventionally, then hole formation is achieved, but guide plate material is damaged and manufacturing yield decreases at small pitches (40 μm)

Engineering Contradiction:
ImproveHole formation capabilityVSAvoidGuide plate integrity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

Holes are pre-drilled in the lower guide plate before final assembly, allowing for precise positioning and alignment. The upper guide plate is then raised to a predetermined height using the raising jig, ensuring that holes align correctly without requiring forceful insertion or repositioning that could damage the material.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The raising jig provides controlled support and cushioning during the assembly process, preventing excessive force from being applied to the guide plates. This cushioning effect protects the fragile material between holes from being ripped apart during alignment and insertion operations.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Adaptability or versatility

If probe pins with small pitch (40 μm) are assembled, then testing capability for fine-pitch contact pads is achieved, but assembly yield decreases due to material damage

Engineering Contradiction:
ImproveFine-pitch testing capabilityVSAvoidAssembly manufacturing yield
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The raising jig serves as a mediator that enables precise assembly of fine-pitch probe pins without direct manual manipulation. By providing controlled positioning and support, the jig allows high-yield assembly of 40 μm pitch probe pins while maintaining the ability to test fine-pitch contact pads.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS8723538B2Probe head formation methods employing guide plate raising assembly mechanism
Publication Date: 2014.05.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US8723538B2 patent drawing
  • US8723538B2 patent drawing
  • US8723538B2 patent drawing

AI summary

An assembly includes a lower guide plate having a first plurality of through-holes therein, and an upper guide plate over the lower guide plate. The upper guide plate includes a second plurality of through-holes therein. The assembly further includes a plurality of probe pins. Each of the probe pins is inserted through one of the first plurality of through-holes and one of the second plurality of through-holes. The assembly further includes a plurality of probe pin stoppers, each attached to one of the probe pins, wherein the plurality of probe pin stoppers has lateral sizes greater than lateral sizes of the second plurality of through-holes. The plurality of probe pin stoppers is located over the upper guide plate.