Probe Head Alignment Using Spare Guide Holes for Pad Contact
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Solution Overview
Problem
Manufacturing errors in probe heads and electrode substrates can cause misalignment of guide pins and electrode pads, leading to insufficient contact and imprecise electric measurement of inspection objects.
Innovation Solution
The electric connection device incorporates a guide hole group with a reference guide hole and spare guide holes, allowing guide pins to be fitted into spare guide holes to ensure proper alignment and contact between probes and electrode pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If guide pin is inserted into guide hole for alignment, then alignment process is simplified, but manufacturing errors cause misalignment between probe and electrode pad
Solution Approach 1:
The patent changes the parameter of guide hole positioning by providing multiple guide holes at different positions instead of a single fixed guide hole. This allows selection of the most appropriate guide hole based on actual alignment requirements, compensating for manufacturing errors in probe head and electrode substrate positions.
Solution Approach 2:
The patent introduces flexibility into the alignment system by allowing dynamic selection among multiple guide holes. The operator can choose which guide hole to use based on the actual alignment situation, making the rigid guide pin-guide hole mechanism adaptable to manufacturing variations.
2Device complexity
If single guide hole is used for alignment, then device structure is simplified, but alignment precision deteriorates due to manufacturing errors
Solution Approach 1:
The patent divides the single guide hole into multiple guide holes positioned at different locations. This segmentation allows the system to handle manufacturing errors by providing alternative alignment references, improving probe-electrode pad alignment precision without significantly increasing overall device complexity.
Solution Approach 2:
The patent changes the spatial parameters of the guide hole structure by creating multiple guide holes at different positions and orientations. This provides multiple alignment references that can compensate for manufacturing errors in the probe head and electrode substrate, improving alignment precision.
Data Source
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Figure 5~6(b)
AI summary
An electric connection device includes: a probe (11); a probe head (12) that holds the probe (11); and an electrode substrate (13) on which an electrode pad (131) to be connected to a proximal end of the probe (11) is provided. The probe head (12) is provided with a guide pin (14) for alignment of the probe head (12) and the electrode substrate (13), and the electrode substrate (13) is provided with a guide hole group composed of a plurality of guide holes corresponding to the guide pin (14).