Probe Head Structure for 3D IC Testing

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The increasing complexity of semiconductor integrated circuit designs and the development of 3D structures require new test equipment capable of effectively testing these complex structures without damaging the components or the probe head during the testing process.

Innovation Solution

A probe head system with a protruding surface featuring a plurality of probe needles arranged around an inner recess, allowing the needles to connect with contacts on 3D integrated circuit packages without physically damaging the top package component, which is positioned within the recess, and a probe card connected to a test head for generating control and data signals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If probe needles are used to test 3D integrated circuit packages, then testing capability is improved, but physical damage to package components or probe head may occur

Engineering Contradiction:

Improvetesting capabilityVSAvoidphysical damage

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The probe head includes an inner recess that accommodates the top package component, with probe needles extending around the recess to contact lower package components. This nested structure allows the top package to be positioned within the recess while probe needles contact contacts on lower packages, enabling testing of 3D stacked packages without damaging the top package or probe head.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The inner recess acts as an intermediary structure that physically separates the probe needles from the top package component. By providing this intermediate space, the top package can be supported and positioned without direct contact with probe needles, preventing physical damage while still enabling electrical testing of the stacked package structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of operation

If probe head contacts top package component, then positioning is simplified, but physical collision and damage risk increases

Engineering Contradiction:

ImprovepositioningVSAvoidphysical collision risk

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The inner recess is designed to accommodate the top package component, creating a nested arrangement where the top package fits within the recess space. This provides natural positioning guidance and mechanical support for the top package while maintaining clearance between the package and probe needles, reducing collision risk during positioning and testing operations.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Productivity

If probe needles contact lower package contacts, then testing function is achieved, but top package may be damaged by probe head structure

Engineering Contradiction:

Improvetesting functionVSAvoidtop package damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The inner recess provides a protected space that accommodates the top package component while allowing probe needles to extend around it and contact lower package components. This nested configuration enables testing of lower package contacts through the recess structure without the probe head directly contacting or damaging the top package.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The inner recess serves as an intermediary structure that allows probe needles to reach lower package contacts while preventing direct contact between the probe head and top package. This intermediate space enables the testing function to be achieved on lower packages while protecting the top package from mechanical damage.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11199576B2Probe head structure of probe card and testing method

Publication Date: 2021.12.14 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A probe head and methods of testing a device using a probe head are provided. The probe head includes a first end connected to a first substrate. The first substrate is configured to be connected to a test head. The probe head also includes second end having a first inner recess surrounded by a first protrusion and a first plurality of probe needles connected to the first protrusion.