Ultrasonic Probe Heat Dissipation Sheet Design
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Solution Overview
Problem
The existing esophagus probe for three-dimensional ultrasound diagnosis faces challenges in heat dissipation, as heat generated in the electronic circuit board is conducted to the two-dimensional array transducer, leading to increased temperature and degradation, with inefficient heat conduction to the heat sink due to its placement on the back surface with a backing layer in between.
Innovation Solution
The ultrasonic probe incorporates a heat dissipation sheet with a body portion and wings that conduct heat from the electronic circuit board to the probe head case, utilizing an opening structure to insert and join the wings to the case, allowing for direct heat dissipation to the outer surface or inner surface, thereby reducing temperature increase and improving heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is provided on the back surface side of the electronic circuit board with a backing layer therebetween, then heat dissipation structure is established, but heat conduction efficiency from electronic circuit board to heat sink is insufficient
Solution Approach 1:
The invention extracts the heat dissipation function from the conventional heat sink placement and implements it through a heat dissipation sheet that directly contacts the electronic circuit board. The heat dissipation sheet is formed with a body portion contacting the circuit board and wings extending to the probe head case, separating the heat conduction path from the traditional backing layer configuration.
Solution Approach 2:
The heat dissipation sheet acts as an intermediary between the electronic circuit board and the probe head case. It comprises a body portion that receives heat from the circuit board and wings that conduct this heat to the probe head case, providing an efficient thermal pathway without requiring direct contact with the backing layer.
2Device complexity
If heat is conducted to the two-dimensional array transducer, then thermal management is simplified, but temperature of the array transducer increases causing degradation
Solution Approach 1:
The invention extracts the heat dissipation function from the conventional heat sink placement and implements it through a heat dissipation sheet that directly contacts the electronic circuit board. The heat dissipation sheet is formed with a body portion contacting the circuit board and wings extending to the probe head case, separating the heat conduction path from the traditional backing layer configuration.
Solution Approach 2:
The heat dissipation sheet acts as an intermediary between the electronic circuit board and the probe head case. It comprises a body portion that receives heat from the circuit board and wings that conduct this heat to the probe head case, providing an efficient thermal pathway without requiring direct contact with the backing layer.
3Temperature
If heat dissipation sheet with wings is inserted into opening structure and joined to probe head case, then heat dissipation efficiency is improved, but assembly complexity increases
Solution Approach 1:
The heat dissipation sheet is segmented into distinct functional portions: a body portion for heat reception from the electronic circuit board and multiple wings for heat conduction to the probe head case. This segmentation allows each portion to be optimized for its specific function while maintaining overall manufacturability.
Solution Approach 2:
The wings of the heat dissipation sheet are inserted into opening structures within the probe head case, creating a nested configuration where the heat dissipation components are housed within the case structure. This nesting approach integrates multiple functions into a unified assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from the electronic circuit board, inhibiting temperature rise in the array transducer and transmission/reception surface, enhancing the probe's operational efficiency and image quality by using a heat dissipation sheet with superior thermal conductivity and flexible wings for improved assembly and heat conduction.
Implementation Method 1
a heat dissipation sheet that conducts heat from the electronic circuit board
Data Source
AI summary
A probe that is inserted into a body cavity, wherein an inner unit (inner assembly) comprises an oscillator unit, an intermediate substrate, an electronic circuit substrate, and a backing member. An exhaust heat sheet is joined to an area at the perimeter of the rear surface of the electronic circuit substrate. The exhaust heat sheet comprises a main body part and a plurality of wings that extend to the outside from the main body part. The plurality of wings include a right wing and a left wing. The wings are inserted into two slits formed in a probe head case (heat radiating shell), and the end parts of the wings are accommodated in and adhered to two recessed sections formed in the outer surface of the probe head case. Thus, heat generated inside the probe head case can be directly transferred to the outer surface of the probe head case.