Probe Integrated Circuit for High-Density Oscilloscope Measurement
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Solution Overview
Problem
Existing active probes used with oscilloscopes are hand-held and awkward to mount in integrated circuit test fixtures, limiting the number of probes that can be mounted due to space constraints and requiring close proximity to signal nodes to minimize loading effects.
Innovation Solution
Implementing an active probe entirely as a packaged integrated circuit (IC) with a small, low pin count package to facilitate high mounting density, and including an interface for configuration and customized software to control the IC and measurement instrumentation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If hand-held active probes are used, then measurement capability is provided, but mounting density is limited due to space constraints and awkward mounting requirements
Solution Approach 1:
The probe system is segmented into a modular integrated circuit package that can be mounted directly on the test fixture substrate, separating the probe functionality from the traditional hand-held probe structure. This allows multiple probe ICs to be distributed across the fixture surface, dramatically increasing probe density while simplifying mounting through standard PCB mounting techniques.
2Measurement precision
If hand-held probes are used, then signal measurement is achieved, but probe placement precision is limited by the need for close proximity to signal nodes
Solution Approach 1:
The probe IC merges the probe tip, signal conditioning circuitry, and mounting structure into a single integrated component that is directly mounted on the test fixture. This integration eliminates the need for separate hand-held probes and complex mounting arrangements, enabling precise placement at signal nodes while simplifying the overall system.
3Quantity of substance
If multiple hand-held probes are mounted in a small area, then measurement coverage increases, but mounting difficulty increases due to space constraints
Solution Approach 1:
The probe system transitions from three-dimensional hand-held probes requiring vertical clearance to two-dimensional integrated circuit packages that lie flat on the fixture surface. This dimensional change allows multiple probes to be densely packed in the planar space of the fixture without interfering with each other, greatly increasing probe density while simplifying manufacturing.
Data Source
AI summary
Disadvantages associated with present day instrument probes, e.g., active probes used with oscilloscopes, may be overcome by implementing an active probe entirely as a packaged integrated circuit (IC). The probe IC may be implemented in a small, low pin-count package to facilitate the mounting of many probe ICs in a small area. The probe IC may include an interface for configuration as well as customized software to control the probe IC and measurement instrumentation, for example, an oscilloscope, for a variety of applications. The probe IC may be implemented as any one of different types of probes, including active probes and passive probes, voltage probes and current probes, or single ended probes and differential probes.