Probe Structure with Linear Conductive Path for High-Frequency Signal Transmission
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Solution Overview
Problem
Conventional probe structures for semiconductor wafer or IC testing face challenges in transmitting high-frequency signals and high currents due to inductive effects and material limitations, which can lead to signal loss and damage from excessive current.
Innovation Solution
A probe structure comprising two probe heads with an elastic buffer portion and a conductive portion within a hollow space, where the conductive portion is linearly extended between the probe heads when not in use and forms an elastic deformation when in use, allowing for efficient high-frequency and high-current transmission without relying on a spring structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spring structure is used to transfer signals in the probe, then the probe can maintain contact with the wafer, but the inductive effect is generated while transferring high frequency signals
Solution Approach 1:
The patent extracts the harmful spring structure from the signal transfer path and replaces it with a conductive portion. The spring structure is removed entirely from the electrical connection path, eliminating the source of inductive effects while maintaining mechanical contact function through the elastic buffer portion.
Solution Approach 2:
The patent divides the probe structure into separate functional components: the elastic buffer portion handles mechanical contact and absorption, while the conductive portion handles electrical signal transfer. This segmentation allows each component to be optimized for its specific function without the compromises required by a unified spring structure.
2Length of moving object
If the spring structure has small sectional area, then the probe size is reduced, but the probe cannot carry high current without burning
Solution Approach 1:
The patent separates the mechanical function (elastic buffer portion) from the electrical conduction function (conductive portion). The conductive portion can be designed with sufficient cross-sectional area to carry high currents without being constrained by the space-saving requirements of the elastic buffer portion.
Solution Approach 2:
The harmful spring structure is extracted from the electrical conduction path and replaced with a dedicated conductive portion. This allows the electrical path to be optimized purely for current carrying capacity without the geometric constraints of a spring design.
3Strength
If the probe housing is added to make the probe structure bigger, then the probe has better structural support, but the exterior size becomes too big for micro pitch applications
Solution Approach 1:
The elastic buffer portion serves multiple functions simultaneously: it provides structural support, enables mechanical contact with the wafer, absorbs contact forces, and guides the conductive portion. This multi-functionality eliminates the need for separate structural support components that would increase the probe's exterior size.
Solution Approach 2:
The patent merges the mechanical support function and the electrical conduction function into a single integrated structure. The elastic buffer portion and conductive portion work together as a unified assembly, eliminating the need for additional housing or support structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces inductive effects and supports higher current loads by using a linear conductive path, preventing signal loss and damage, and is suitable for micro-pitch applications.
Implementation Method 1
the elastic buffer portion encloses a hollow space... the conductive portion forms an elastic deformation between the two probe heads
Data Source
AI summary
A probe structure is provided, including two probe heads for electrically contacting with the two objects, respectively, an elastic buffer portion forming a hollow space therein, a conductive portion being disposed within the hollow space and thereby being surrounded by the elastic buffer portion, and having two ends respectively electrically being connected to the two probe heads. When the two probe heads do not contact with the two objects electrically, the conductive portion is linearly extended between the two probe heads.