Semiconductor Probe Member Boundary Surface Reduction

The patent merges the contact portion and body portion into a single integrated structure formed through multiple plating processes on a unified substrate. Instead of assembling separate components that would create multiple boundary surfaces, the invention combines them into one piece with minimized boundary surfaces, thereby improving durability while managing manufacturing complexity through process integration rather than component assembly.

The manufacturing process is segmented into distinct plating stages (first plating for contact portion, second plating for body portion) allowing precise control over each region's properties. This process segmentation enables the formation of different materials and structures in specific zones without requiring physical separation of components, thus reducing boundary surfaces while maintaining manufacturing precision.

The patent converts the potential harm of multiple boundary surfaces into a benefit by strategically minimizing and optimizing their number. Instead of eliminating all boundaries (which would reduce manufacturing flexibility), the invention reduces them to the essential minimum required for functional differentiation, thereby improving durability while preserving necessary manufacturing adaptability through controlled boundary placement.

Different regions of the probe member are given different local qualities through selective plating processes. The contact portion receives specific plating for electrical conductivity and contact properties, while the body portion receives different plating for structural properties. This local differentiation achieves manufacturing flexibility without requiring multiple boundary surfaces, as the functional zones are created within a continuous integrated structure.