Probe Misplacement Compensation for Thermal Expansion in Wafer Testing
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Solution Overview
Problem
In wafer testing, probe misplacement occurs due to thermal expansion of metal probes when heated, leading to misalignment between the probe tip and the to-be-tested element at elevated temperatures.
Innovation Solution
A method and probe module that measure the temperature of the probe body, calculate thermal expansion, and adjust the probe or the to-be-tested element accordingly to maintain alignment, using a temperature measurement unit, calculation module, and drive module to compensate for the expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the probe is heated to high temperature for wafer testing, then the testing requirements are met, but thermal expansion occurs causing misplacement between the probe tip and the to-be-tested element
Solution Approach 1:
The patent changes the physical parameter of the probe by introducing a compensation structure that expands or contracts in response to temperature changes. This compensation structure modifies the effective length of the probe body, counteracting the thermal expansion of the metal probe and maintaining alignment precision across different temperatures.
Solution Approach 2:
The patent employs a composite structure combining the metal probe body with a compensation structure made of different material properties. This composite design allows the system to leverage the electrical conductivity and mechanical strength of metal while compensating for its thermal expansion through the compensation structure's opposing dimensional changes.
2Length of moving object
If a long metal probe is used for wafer testing, then the probe can reach the to-be-tested element, but thermal expansion causes misalignment at elevated temperatures
Solution Approach 1:
The patent divides the probe structure into distinct segments: the metal probe body and the separate compensation structure. This segmentation allows each component to perform its specific function independently while working together to maintain overall alignment reliability despite temperature variations.
Solution Approach 2:
The compensation structure dynamically changes its dimensional parameters in response to temperature variations, effectively counterbalancing the thermal expansion of the long metal probe body and maintaining reliable alignment between the probe tip and the to-be-tested element.
3Stability of the object's composition
If the probe body is fixed on the fixing base, then structural stability is provided, but thermal expansion cannot be compensated
Solution Approach 1:
The patent introduces dynamics into the previously static fixed structure by adding a compensation structure that can dynamically adjust its dimensions. This allows the system to maintain structural stability through the fixing base while simultaneously compensating for thermal expansion through the movable compensation mechanism.
Solution Approach 2:
The compensation structure acts as a feedback mechanism that responds to temperature changes affecting the probe body. As the temperature changes cause expansion or contraction, the compensation structure automatically adjusts to counterbalance these changes, providing continuous alignment precision without requiring external control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures continuous alignment between the probe tip and the to-be-tested element by real-time temperature measurement and compensation, effectively addressing thermal expansion-induced misplacement and maintaining contact throughout the testing process.
Implementation Method 1
measuring a temperature of a probe body of the probe body section of the probe or a temperature of a probe body in an environment around the probe body section
Implementation Method 2
thermal expansion amount of the probe along a length direction of the probe body section
Data Source
AI summary
A method for compensating probe misplacement and a probe apparatus are provided. The method is applicable to a probe module which includes a probe and a fixing base. The probe includes a probe body section and a probe tip section. The probe body section is fixed on the fixing base. The method includes: measuring a temperature of a probe body of the probe body section of the probe; calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section; calculating a compensation value according to the thermal expansion amount; moving the probe or a to-be-tested element according to the calculated compensation value, to align a probe tip of the probe tip section with the to-be-tested element or align the to-be-tested element with the probe tip of the probe tip section.