Probe Needle Reaction Force Management in IC Testing Substrates
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Solution Overview
Problem
Conventional chip inspection devices face deformation or cracking issues due to reaction forces from probe needles during testing, especially with thinner converting plates that are not adequately supported.
Innovation Solution
A reinforcement structure is placed between the converting plate and the substrate to absorb and distribute the reaction forces from the probe needles, preventing deformation and cracking by providing additional structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the converting plate is made thinner to reduce cost, then manufacturing cost is reduced, but the converting plate becomes more susceptible to deformation and cracking under probe reaction forces
Solution Approach 1:
The patent employs a composite structure combining a thin converting plate with a reinforcement structure made of different material properties. The reinforcement structure (comprising rigid support elements and flexible connection elements) creates a composite system that exhibits both cost-effectiveness (thin plate) and structural strength (reinforcement), resolving the contradiction between manufacturing cost and structural integrity
Solution Approach 2:
The reinforcement structure is segmented into multiple components: rigid support elements, flexible connection elements, and mounting structures. This segmentation allows each component to perform its specific function - the rigid elements provide structural support, the flexible elements accommodate thermal expansion and mechanical stress, and the mounting structures secure the assembly - collectively preventing deformation and cracking of the thin converting plate
2Productivity
If multiple probes are arranged in a small area on the converting plate, then probing capability is improved, but the reaction force from the DUT concentrates on the thin converting plate causing deformation or cracking
Solution Approach 1:
The reinforcement structure acts as an intermediary between the concentrated probe reaction forces and the thin converting plate. It intercepts and redistributes the concentrated forces from the probes across a larger area through its rigid support elements and flexible connections, preventing the force concentration from reaching and damaging the converting plate while allowing the probes to maintain their close spacing for high probing capability
Solution Approach 2:
The flexible connection elements in the reinforcement structure provide beforehand cushioning by being pre-designed to deform elastically under probe reaction forces. This cushioning effect absorbs and mitigates the concentrated forces before they can cause deformation or cracking in the thin converting plate, allowing the system to withstand high probe densities
Data Source
AI summary
An apparatus for probing die electricity includes a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate includes two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module has a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is made from a polymer gel and disposed between the converting plate and the substrate.