Probe Pad Crack Arresting Strips for Dicing
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Solution Overview
Problem
Dicing operations on integrated circuit substrates often result in cracks propagating from diced edges towards the integrated circuits due to the cutting through of electrical probe pads, which existing technologies fail to adequately prevent.
Innovation Solution
An electrical probe pad structure is formed across the dicing kerf lane with a metal density of less than 70% and includes metal crack arresting strips adjacent to and outside the dicing kerf lane, with optional transverse metal shunts connecting these strips on opposite sides, and crack arresting trenched vias connecting sequential interconnect levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical probe pads are formed with high metal density to ensure electrical connectivity, then electrical conductivity is improved, but crack propagation during dicing operations increases
Solution Approach 1:
The patent applies local quality by creating different metal density regions within the probe pad structure. The interior region has high metal density (first metal fill structures) to ensure electrical conductivity, while the exterior region has low metal density (second metal fill structures) to prevent crack propagation during dicing. This spatial differentiation of metal density allows simultaneous optimization of both electrical connectivity and crack resistance.
2Object-affected harmful factors
If metal density in probe pads is reduced to prevent crack propagation, then crack resistance is improved, but electrical connectivity deteriorates
Solution Approach 1:
The patent segments the probe pad metal fill structures into two distinct types: first metal fill structures in the interior region and second metal fill structures in the exterior region. This segmentation allows each region to serve its specific function - the interior provides electrical connectivity while the exterior provides crack resistance - thereby resolving the contradiction between electrical conductivity and crack propagation prevention.
3Productivity
If dicing operations are performed to separate integrated circuits, then productivity is improved, but substrate damage increases
Solution Approach 1:
The patent implements preliminary action by forming the differentiated metal density structure in the probe pads before the dicing operation. The exterior low-density regions are prepared in advance to act as crack arresting features, so when dicing occurs, cracks are already contained and cannot propagate into the integrated circuits. This preliminary structural preparation enables safe and efficient substrate separation.
Data Source
AI summary
An integrated circuit substrate containing an electrical probe pad structure over, and on both sides of, a dicing kerf lane. The electrical probe pad structure includes metal crack arresting strips adjacent to the dicing kerf lane. A metal density between the crack arresting strips is less than 70 percent. An electrical probe pad structure containing metal crack arresting strips, with a metal density between the crack arresting strips less than 70 percent. A process of forming an integrated circuit by forming an electrical probe pad structure over a dicing kerf lane adjacent to the integrated circuit, such that the electrical probe pad structure has metal crack arresting strips adjacent to the dicing kerf lane, and performing a dicing operation through the electrical probe pad structure.