Probe Pad Structure for Wafer Dicing Edge Integrity

The patent removes the conductive material from the probe pad structure by replacing it with a dielectric layer configuration. The dielectric layer with recesses creates test element groups that can be tested without requiring conductive material at the chip edges, thereby eliminating the source of cracking and peeling during dicing while preserving the testing functionality through alternative electrical connection paths.

The patent changes the material parameter from conductive to dielectric in the probe pad structure. By using a dielectric layer instead of conductive material and configuring recesses to expose underlying conductive layers only where necessary for testing, the design achieves both testing capability and improved dicing performance by reducing metal content at vulnerable edge locations.

The probe pad structure is segmented into multiple functional layers: a dielectric layer with recesses, underlying conductive layers, and specific exposure patterns. This segmentation allows the conductive material to be confined to specific recess areas rather than covering the entire probe pad, reducing overall metal content and improving dicing performance while maintaining manufacturability through standard semiconductor fabrication processes.

The patent applies local quality by creating recesses in the dielectric layer that expose conductive material only in specific localized areas where testing is required. The majority of the probe pad area remains free of conductive material, providing improved dicing performance while maintaining the necessary electrical connections for testing functionality.