Redistribution Layer Recess for Probe Pad Optical Identification

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Solution Overview

Problem

In semiconductor structures, the lack of an optical identification layer between bond pads and probe pads leads to errors during automatic testing, as test devices cannot accurately identify the probe pads.

Innovation Solution

A recess is formed between the bond pad and the probe pad in the re-distribution layer, which serves as an optical identification pattern, and an optical identification layer is applied to expose the bond pad, probe pad, and recess, allowing for accurate identification during testing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If no optical identification layer is provided between bond pad and probe pad, then device complexity is reduced, but test precision deteriorates causing identification errors

Engineering Contradiction:
Improvestructure complexityVSAvoidtest precision
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The space between bond pad and probe pad is segmented by forming a recess, dividing the continuous surface into distinct regions. This segmentation creates a visual boundary that helps test devices differentiate between adjacent pads, improving identification precision without adding complex optical layers.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of applying an optical identification layer across the entire surface, the recess is formed only in the specific local region between bond pad and probe pad. This localized modification provides identification functionality exactly where needed, maintaining simplicity elsewhere while improving test precision.

Inventive Principle:
Principle #3Local quality

2Measurement precision

If optical identification layer is added between bond pad and probe pad, then test precision is improved, but device complexity increases

Engineering Contradiction:
Improvetest precisionVSAvoidstructure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The identification function is extracted from the optical identification layer concept and implemented through a simple recess structure. By removing the need for additional optical materials and layers, the solution achieves pad identification through geometric modification alone, reducing device complexity while maintaining test precision.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of adding a new optical identification layer, the invention uses the recess to create an optical contrast that copies the identification function. The recess acts as a shadow or visual marker that test devices can detect, providing the same identification capability without the complexity of additional layers.

Inventive Principle:
Principle #26Copying

Data Source

PatentUS20230343656A1Semiconductor structure and method for fabricating same
Publication Date: 2023.10.26 CHANGXIN MEMORY TECH INC
  • US20230343656A1 patent drawing
  • US20230343656A1 patent drawing
  • US20230343656A1 patent drawing

AI summary

A semiconductor structure includes a base and a re-distribution layer. The re-distribution layer is disposed on the base and includes a bond pad and a probe pad, the bond pad and the probe pad are disposed adjacent to each other, and a recess is formed in the re-distribution layer and is disposed between the bond pad and the probe pad.